MC100LVEL VНECL Differential Clock D Flip-Flop

Transcription

1 3.3НE ifferential lock Flip-Flop escription The M00E5 is a differential clock flip-flop with reset. The device is functionally equivalent to the E5 device, but operates from a 3.3 supply. With propagation delays and output transition times essentially equal to the E5, the E5 is ideally suited for those applications which require the ultimate in performance at 3.3. The reset input is an asynchronous, level triggered signal. ata enters the master portion of the flip-flop when the clock is OW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. The differential clock inputs of the E5 allow the device to be used as a negative edge triggered flip-flop. The differential input employs clamp circuitry to maintain stability under open input conditions. When left open, the K input will be pulled down to EE and the K input will be biased at /2. Features 475 ps Propagation elay 2. GHz Toggle Frequency ES Protection: >4 k Human Body Model, >200 Machine Model The 00 Series ontains Temperature ompensation PE Mode Operating ange: = to 3. with EE = 0 NE Mode Operating ange: = 0 with EE = to 3. Internal Input Pulldown esistors Meets or Exceeds JEE Spec EI/JES7 I atchup Test Moisture Sensitivity evel For dditional Information, see pplication Note N003/ Flammability ating: U in, Oxygen Index: 2 to 34 Transistor ount = 4 devices Pb Free Packages are vailable SOI SUFFIX SE 75 TSSOP T SUFFIX SE 94 FN MN SUFFIX SE 506 = ssembly ocation = Wafer ot Y = Year W = Work Week M = ate ode = Pb Free Package MKING IGMS* K5 YW *For additional marking information, refer to pplication Note N002/. K5 YW 4G M 4 (Note: Microdot may be in either location) OEING INFOMTION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor omponents Industries,, 2006 ecember, 2006 ev. 4 Publication Order Number: M00E5/

2 2 7 Flip-Flop K 3 6 K 4 5 EE Figure. ogic iagram and Pinout ssignment Table. PIN ESIPTION Table 2. TUTH TBE PIN FUNTION K K, K E ifferential lock Input, E ifferential Output E Input E eset Input Positive Supp;y EE Negative Supply EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. H X H Z = OW to HIGH Transition X = on t are Z Z X H Table 3. MXIMUM TINGS Symbol Parameter ondition ondition 2 ating Unit PE Mode Power Supply EE = 0 to 0 EE NE Mode Power Supply = 0 to 0 I PE Mode Input oltage NE Mode Input oltage EE = 0 = 0 I out Output urrent ontinuous Surge I 6 to 0 I EE 6 to T Operating Temperature ange 40 to +5 T stg Storage Temperature ange 65 to +50 J Thermal esistance (Junction to mbient) 0 lfpm 500 lfpm SOI SOI J Thermal esistance (Junction to ase) Standard Board SOI 4 to 44 ± 5% /W J Thermal esistance (Junction to mbient) 0 lfpm 500 lfpm TSSOP TSSOP J Thermal esistance (Junction to ase) Standard Board TSSOP 4 to 44 ± 5% /W J Thermal esistance (Junction to mbient) 0 lfpm 500 lfpm T sol Wave Solder Pb Pb Free <2 to 3 24 <2 to FN FN Stresses exceeding Maximum atings may damage the device. Maximum atings are stress ratings only. Functional operation above the ecommended Operating onditions is not implied. Extended exposure to stresses above the ecommended Operating onditions may affect device reliability m m /W /W /W /W /W /W 2

3 Table 4. PE HTEISTIS = 3.3 ; EE = 0.0 (Note ) Symbol haracteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply urrent m OH Output HIGH oltage (Note 2) m O Output OW oltage (Note 2) m IH Input HIGH oltage (Single Ended) m I Input OW oltage (Single Ended) m IHM Input HIGH oltage ommon Mode ange (ifferential) (Note 6) PP < 500 m PP 500 m.2.4 I IH Input HIGH urrent I I Input OW urrent Others K NOTE: evice will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. evice specification limit values are applied individually under normal operating conditions and not valid simultaneously.. Input and output parameters vary : with. EE can vary ± Outputs are terminated through a 50 resistor to IHM min varies : with EE, max varies : with. The IHM range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between PP min and...3 Table 5. NE HTEISTIS = 0.0 ; EE = 3.3 (Note 4) Symbol haracteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply urrent m OH Output HIGH oltage (Note 5) m O Output OW oltage (Note 5) m IH Input HIGH oltage (Single Ended) m I Input OW oltage (Single Ended) m IHM Input HIGH oltage ommon Mode ange (ifferential) (Note 6) PP < 500 m PP 500 m 2..9 I IH Input HIGH urrent I I Input OW urrent Others K NOTE: evice will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. evice specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary : with. EE can vary ± Outputs are terminated through a 50 resistor to IHM min varies : with EE, max varies : with. The IHM range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between PP min and

4 Table 6. HTEISTIS = 3.3 ; EE = 0.0 or = 0.0 ; EE = 3.3 (Note 7) Symbol haracteristic Min Typ Max Min Typ Max Min Typ Max Unit f max Maximum Toggle Frequency GHz t PH t PH Propagation elay to Output K ps t S Setup Time ps t H Hold Time ps t eset ecovery ps t PW Minimum Pulse K Width eset ps t JITTE ycle to ycle Jitter TB TB TB ps PP Input Swing (Note ) m t r t f Output ise/fall Times (20% 0%) ps NOTE: evice will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. evice specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. EE can vary ±0.3.. PP (min) is minimum input swing for which parameters are guaranteed. river evice Z o = 50 Z o = 50 eceiver evice TT TT = Figure 2. Typical Termination for Output river and evice Evaluation (See pplication Note N020/ Termination of E ogic evices.) 4

5 OEING INFOMTION evice Package Shipping M00E5 SOI 9 Units / ail M00E5G SOI 9 Units / ail M00E52 SOI 2500 / Tape & eel M00E52G SOI 2500 / Tape & eel M00E5T TSSOP 00 Units / ail M00E5TG TSSOP 00 Units / ail M00E5T2 TSSOP 2500 / Tape & eel M00E5T2G TSSOP 2500 / Tape & eel M00E5MN4 FN 000 / Tape & eel M00E5MN4G FN 000 / Tape & eel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and eel Packaging Specifications Brochure, B0/. esource eference of pplication Notes N405/ E lock istribution Techniques N406/ esigning with PE (E at +5.0 ) N503/ EinPS I/O SPiE Modeling Kit N504/ Metastability and the EinPS Family N56/ Interfacing Between S and E N672/ The E Translator Guide N00/ Odd Number ounters esign N002/ Marking and ate odes N020/ Termination of E ogic evices N066/ Interfacing with EinPS N090/ haracteristics of E evices 5

6 PKGE IMENSIONS SOI NB SE ISSUE H Y B X 5 4 S 0.25 (0.00) M Y M K NOTES:. IMENSIONING N TOENING PE NSI Y4.5M, ONTOING IMENSION: MIIMETE. 3. IMENSION N B O NOT INUE MO POTUSION. 4. MXIMUM MO POTUSION (0.006) PE SIE. 5. IMENSION OES NOT INUE MB POTUSION. OWBE MB POTUSION SH BE 0.27 (0.005) TOT IN EXESS OF THE IMENSION T MXIMUM MTEI ONITION THU E OBSOETE. NEW STN IS Z H G 0.25 (0.00) M Z Y S X S SETING PNE 0.0 (0.004) N X 45 M J MIIMETES INHES IM MIN MX MIN MX B G.27 BS BS H J K M 0 0 N S SOEING FOOTPINT* SE 6: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques eference Manual, SOEM/. 6

7 PKGE IMENSIONS TSSOP T SUFFIX PSTI TSSOP PKGE SE ISSUE (0.006) T (0.006) T U U S 2X /2 PIN IENT S 5 x K EF (0.004) M T U S S B U F 0.25 (0.00) M NOTES:. IMENSIONING N TOENING PE NSI Y4.5M, ONTOING IMENSION: MIIMETE. 3. IMENSION OES NOT INUE MO FSH. POTUSIONS O GTE BUS. MO FSH O GTE BUS SH NOT EXEE (0.006) PE SIE. 4. IMENSION B OES NOT INUE INTEE FSH O POTUSION. INTEE FSH O POTUSION SH NOT EXEE 0.25 (0.00) PE SIE. 5. TEMIN NUMBES E SHOWN FO EFEENE ONY. 6. IMENSION N B E TO BE ETEMINE T TUM PNE W. 0.0 (0.004) T SETING PNE G ETI E ETI E W MIIMETES INHES IM MIN MX MIN MX B F G 0.65 BS BS K BS 0.93 BS M

8 PKGE IMENSIONS FN SE ISSUE PIN ONE EFEENE B NOTES:. IMENSIONING N TOENING PE SME Y4.5M, ONTOING IMENSION: MIIMETES. 3. IMENSION b PPIES TO PTE TEMIN N IS MESUE BETWEEN 0.25 N 0.30 MM FOM TEMIN. 4. OPNITY PPIES TO THE EXPOSE P S WE S THE TEMINS. 2 X X 0.0 ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ TOP IEW E MIIMETES IM MIN MX EF b BS E 2.00 BS E e 0 BS K X SETING PNE 0.0 SIE IEW (3) 2 e/2 4 X e E2 K 5 X b B NOTE 3 BOTTOM IEW EinPS is a trademark of Semiconductor omponents INdustries, (SI). ON Semiconductor and are registered trademarks of Semiconductor omponents Industries, (SI). SI reserves the right to make changes without further notice to any products herein. SI makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SI assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SI data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SI does not convey any license under its patent rights nor the rights of others. SI products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SI product could create a situation where personal injury or death may occur. Should Buyer purchase or use SI products for any such unintended or unauthorized application, Buyer shall indemnify and hold SI and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SI was negligent regarding the design or manufacture of the part. SI is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBITION OEING INFOMTION ITETUE FUFIMENT: iterature istribution enter for ON Semiconductor P.O. Box 563, enver, olorado 027 US Phone: or Toll Free US/anada Fax: or Toll Free US/anada orderlit@onsemi.com N. merican Technical Support: Toll Free US/anada Europe, Middle East and frica Technical Support: Phone: Japan ustomer Focus enter Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales epresentative M00E5/