MEMS Technologies Dresden - Product Development and Fabrication at IPMS Dresden
|
|
|
- Marjorie Bradford
- 5 years ago
- Views:
Transcription
1 MEMS Technologies Dresden - Product Development and Fabrication at IPMS Dresden
2 MEMS Technologies Dresden - Product Development and Fabrication at IPMS Dresden Michael Müller, Matthias List Outline FhG-IPMS at a glance R&D and foundry IPMS Technology toolset and MEMS clean IPMS Examples of MEMS IPMS
3 1992 Foundation of the Dresden part of the Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) 2003 Foundation of the Fraunhofer Institute for Photonic Microsystems (IPMS) 2007 Launch of a new clean room IPMS at a Glance 2010 Budget: Staff: 26 Mio (9 Mio from industrial projects) 250 employees & scientific assistants
4 R&D and Foundry IPMS Micro Scanner Devices Spatial Light Modulators Core IPMS Micro Scanner Devices MEMS scanner for: 1D & 2D-scanner Projection displays Grating spectrometer Optical path length modulator µmirror arrays for: Mask writing systems Phase shift for image correction Programmable illumination (microscope) Bulk MEMS technology Spatial Light Modulators Surface MEMS technology (thin film) & Monolithic integrated CMOS
5 Micro Scanner Devices MEMS scanner for: 1D & 2D-scanner Projection displays Grating spectrometer Optical path length modulator R&D and Foundry IPMS Spatial Light Modulators µmirror arrays for: Mask writing systems Phase shift for image correction Programmable illumination (microscope) Long-term gained expert knowledge Product & MEMS technology development Bulk MEMS Technology Surface MEMS Technology (thin film) R&D from idea to prototype Small & medium volume production Characterization & Test MEMS-Technology Competency
6 Micro Scanner Devices MEMS scanner for: 1D & 2D-scanner Projection displays Grating spectrometer Optical path length modulator R&D and Foundry IPMS Spatial Light Modulators µmirror arrays for: Mask writing systems Phase shift for image correction Programmable illumination (microscope) Long-term gained expert knowledge Product & MEMS technology development Bulk MEMS Technology Surface MEMS Technology (thin film) R&D from idea to prototype Small & medium volume production Characterization & Test MEMS-Technology Competency MEMS Foundry
7 R&D and Foundry IPMS Micro Scanner Devices MEMS scanner for: 1D & 2D-scanner Projection displays Grating spectrometer Optical path length modulator Spatial Light Modulators µmirror arrays for: Mask writing systems Phase shift for image correction Programmable illumination (microscope) Services from R&D to fabrication Single process steps Process modules Complete processes Customized devices in IPMS Technologies Processes on customers demand What markets are we targeting? R&D intensive services & products Niche markets & products Small & medium volume MEMS-Technology Competency MEMS Foundry
8 MEMS Clean Room 1500 m 2, class 10 6 Wafer line 0.5 µm structure size for MEMS 5 / 24 shift operations for R&D & pilot fabrication MEMS Technologies Dresden PPS based planning and operating ISO 9001:2008 certification
9 Technology IPMS MEMS/ MOEMS CMOS & active Silicon Bulk MEMS 3-dim. structures in silicon Applications: MEMS Scanner Pressure Sensor Surface MEMS Thin film surface MEMS MEMS on CMOS Applications: Spatial Light Modulator High Voltage CMOS Photodiodes ph- Sensor
10 Surface MEMS Technology Fabrication of MEMS structures on the wafer surface for monolithic integration of CMOS & MEMS Spatial light IPMS Analogue deflection UV application (248nm) Planarity< 16µm Pitch row line n-1 row line n column lines m m+1 m+2 m+3
11 Surface MEMS Technology 3rd Generation Spatial Light IPMS 2- level architecture Actuator: Mirror: > amorphous materials > drift free operation > High deflection up 5 µm > 2- axis deflection > Al- Alloy, a-si, stacks > large & tunable reflection Hinge Mirror Mirror Hinge Mirror Hinge
12 Bulk MEMS Technology Fabrication of sensors & actors out of the wafer s material (bulk) itself MEMS scanning IPMS 1D & 2D deflection Rotational & translational deflection Resonant & quasi-static actuation IPMS 2D- MEMS Scanner: rotational, resonant 1D- MEMS Scanner: translational, resonant
13 Examples of MEMS IPMS Micro mirror arrays as programmable mask Barcode reading systems based on micro scanning mirrors Piezo- resistive pressure sensors for automotive applications
14 IN A NUTSHELL IPMS is your partner for MEMS & MOEMS Technology Bulk & Surface MEMS technology From R&D to fabrication
15 THANK YOU FOR YOUR ATTENTION! Hall 1, Booth or Michael Müller Matthias List 0049 (0) or
Advanced Sensor Technologies
Advanced Sensor Technologies Jörg Amelung Fraunhofer Institute for Photonics Microsystems Name of presenter date Sensors as core element for IoT Next phase of market grow New/Advanced Requirements based
PROCESS TECHNOLOGIES FOR ADVANCED ORGANIC ELECTRONIC DEVICES: MICRODISPLAYS, LIGHTING AND SOLAR CELLS
PROCESS TECHNOLOGIES FOR ADVANCED ORGANIC ELECTRONIC DEVICES: MICRODISPLAYS, LIGHTING AND SOLAR CELLS Dr. Christian May Fraunhofer IPMS - Center for Organic Materials and Electronic Devices Dresden COMEDD
Large-Scale Polysilicon Surface Micro-Machined Spatial Light Modulator
Large-Scale Polysilicon Surface Micro-Machined Spatial Light Modulator Clara Dimas, Julie Perreault, Steven Cornelissen, Harold Dyson, Peter Krulevitch, Paul Bierden, Thomas Bifano, Boston Micromachines
Lecture 20 Optical MEMS (2)
EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 20 Optical MEMS (2) Agenda: MOEMS Introduction Micromirrors EEL6935 Advanced MEMS 2005 H. Xie 3/30/2005 1 Optical MEMS Topics Introduction
MEMS Technologies for Optical Applications
MEMS Technologies for Optical Applications Dr. Veljko Milanović Adriatic Research Institute 2131 University Ave Suite 322 Berkeley, CA 94704-1079 http://www.adriaticresearch.org Outline Motivations and
Digital Light Processing
A Seminar report On Digital Light Processing Submitted in partial fulfillment of the requirement for the award of degree of Bachelor of Technology in Computer Science SUBMITTED TO: www.studymafia.org SUBMITTED
The German OLED research association CARO presents innovations in OLED device integration technology for automotive applications
PRESS RELEASE May 2009-1 - The German OLED research association CARO presents innovations in OLED device integration technology for automotive applications The German research association»caro«(car OLED,
Photonic Devices for Vehicle Evolution
Photonic Devices for Vehicle Evolution - The Latest in Optical MEMS and Solid State Photonics HAMAMATSU PHOTONICS UK Nov 2015 Jack Bennett Company Overview 4 Divisions Technology company, with focus on
MEMS Technologies for Optical and Bio-Medical Applications
MEMS Technologies for Optical and Bio-Medical Applications Dr. Veljko Milanović Dr. Daniel T. McCormick Adriatic Research Institute Berkeley, CA http://www.adriaticresearch.org Adriatic Research Institute,
Entwicklungen der Mikrosystemtechnik. in Chemnitz
Entwicklungen der Mikrosystemtechnik Gliederung: in Chemnitz Fraunhofer Institut für f r Zuverlässigkeit und Mikrointegration IZM Institutsteil Multi Device Integration, Chemnitz, Thomas Gessner jan.mehner@che.izm.fhg.de
MEMS Mirror: A8L AU-TINY48.4
MEMS Mirror: A8L2.2-4600AU-TINY48.4 Description: The new A8L2 actuator is based on an established robust two-axis MEMS design which supports various bonded mirror sizes in largeangle beam steering. Previous
Project TRIPLE-S Microscope: Contribution of AMG Technology Ltd.
Project TRIPLE-S Microscope: Contribution of AMG Technology Ltd. V. Stavrov, G. Stavreva EUROSTARS ROADSHOW - SOFIA, May 26 th, 2015 1 About AMG Technology Ltd. Company Technology background Project TRIPLE-S
Multilevel Beam SOI-MEMS for Optical Applications
pp. 281-285 Multilevel Beam SOI-MEMS for Optical Applications Veljko Milanović Adriatic Research Institute 2131 University Ave., Suite 322, Berkeley, CA 94704 veljko@adriaticresearch.org Abstract A microfabrication
ABSTRACT 1 INTRODUCTION
Novel lithography technique using an ASML Stepper/Scanner for the manufacture of display devices in MEMS world ASML US, Inc Special Applications, 6580 Via Del Oro San Jose, CA 95119 Keith Best, Pankaj
IN-VISION All rights reserved. IN-VISION GmbH. B2B DLP Light Engine and Optical Solutions
IN-VISION 2017. All rights reserved. IN-VISION GmbH B2B DLP Light Engine and Optical Solutions Company Long-term experience in development and manufacturing of high-end optical projection lens assemblies
1. Publishable summary
1. Publishable summary 1.1. Project objectives. The target of the project is to develop a highly reliable high brightness conformable low cost scalable display for demanding applications such as their
An Alternative Architecture for High Performance Display R. W. Corrigan, B. R. Lang, D.A. LeHoty, P.A. Alioshin Silicon Light Machines, Sunnyvale, CA
R. W. Corrigan, B. R. Lang, D.A. LeHoty, P.A. Alioshin Silicon Light Machines, Sunnyvale, CA Abstract The Grating Light Valve (GLV ) technology is being used in an innovative system architecture to create
MEMS4Display MEMS-based microdisplays market analysis. Report name : MEMS4Display Publication date : March 2006
MEMS4Display MEMS-based microdisplays market analysis 2006 Report name : MEMS4Display Publication date : March 2006 Content Definitions and methodology The MEMS market The 2005-2010 MEMS market forecast
SPATIAL LIGHT MODULATORS
SPATIAL LIGHT MODULATORS Reflective XY Series Phase and Amplitude 512x512 A spatial light modulator (SLM) is an electrically programmable device that modulates light according to a fixed spatial (pixel)
Press Release Plastic Electronics 2013 October 8th 10th, 2013, in Dresden/Germany Hall 2, booth no. 292 (joint booth of Organic Electronic Saxony)
Press Release Plastic Electronics 2013 October 8th 10th, 2013, in Dresden/Germany Hall 2, booth no. 292 (joint booth of Organic Electronic Saxony) Flexible OLED from the roll Tridonic Dresden and Fraunhofer
Lecture Flat Panel Display Devices
Lecture 1 6.976 Flat Panel Display Devices Outline Overview of 6.976 Overview Flat Panel Display Devices Course website http://hackman.mit.edu Reading Assignment: Article by Alt and Noda, IBM Journal of
Applied Materials. 200mm Tools & Process Capabilities For Next Generation MEMS. Dr Michel (Mike) Rosa
Applied Materials 200mm Tools & Process Capabilities For Next Generation MEMS Dr Michel (Mike) Rosa 200mm MEMS Global Product / Marketing Manager, Components and Systems Group (CSG), Applied Global Services
Spatial Light Modulators XY Series
Spatial Light Modulators XY Series Phase and Amplitude 512x512 and 256x256 A spatial light modulator (SLM) is an electrically programmable device that modulates light according to a fixed spatial (pixel)
NP-AFM. Samples as large as 200 x 200 x 20 mm are profiled by the NP-AFM system, and several stage options are available for many types of samples.
NP-AFM The NP-AFM is a complete nanoprofiler tool including everything required for scanning samples: microscope stage, electronic box, control computer, probes, manuals, and a video microscope. Samples
Intensity based laser distance measurement system using 2D electromagnetic scanning micromirror
https://doi.org/10.1186/s40486-018-0073-2 LETTER Open Access Intensity based laser distance measurement system using 2D electromagnetic scanning micromirror Kyoungeun Kim, Jungyeon Hwang and Chang Hyeon
projectors, head mounted displays in virtual or augmented reality use, electronic viewfinders
Beatrice Beyer Figure 1. (OLED) microdisplay with a screen diagonal of 16 mm. Figure 2. CMOS cross section with OLED on top. Usually as small as fingernails, but of very high resolution Optical system
center for organic materials and electronic devices dresden
F R A U N H O F E R I N S T I T U T e F o R P h o t o n i c M i c r o S y s t e m s I P M S center for organic materials and electronic devices dresden p r e f a c e Dr. Christian May Head of Business
RFSOI and FDSOI enabling smarter and IoT applications. Kirk Ouellette Digital Products Group STMicroelectronics
RFSOI and FDSOI enabling smarter and IoT applications Kirk Ouellette Digital Products Group STMicroelectronics ST in the IoT already Today 2 Kirk Ouellette More then Moore Workshop - Shanghai - March 17,
Luiz Claudio M. Oliveira Khaled M. Ahmida
Luiz Claudio M. Oliveira marangoni@fem.unicamp.br Khaled M. Ahmida khaled@fem.unicamp.br Luiz Otávio S. Ferreira lotavio@fem.unicamp.br State University of Campinas UNICAMP Faculty of mechanical Engineering
Flexible Electronics Production Deployment on FPD Standards: Plastic Displays & Integrated Circuits. Stanislav Loboda R&D engineer
Flexible Electronics Production Deployment on FPD Standards: Plastic Displays & Integrated Circuits Stanislav Loboda R&D engineer The world-first small-volume contract manufacturing for plastic TFT-arrays
THE challenges facing today s mobile
MEMS displays MEMS-Based Display Technology Drives Next-Generation FPDs for Mobile Applications Today, manufacturers of mobile electronic devices are faced with a number of competitive challenges. To remain
In the September/October issue of Small Times
Thinking outside the chip: MEMS-based systems solutions by Roger H. Grace, Roger Grace Associates In the September/October issue of Small Times (p.32) I introduced a MEMS Commercialization Report Card
ORGANIC ELECTRONICS PROCESS DEVELOPMENT AND ENCAPSULATION TECHNOLOGIES
FRAUNHOFER INSTITUTE FOR ORGANIC ELECTRONICS, ELECTRON BEAM AND PLASMA TECHNOLOGY FEP ORGANIC ELECTRONICS PROCESS DEVELOPMENT AND ENCAPSULATION TECHNOLOGIES 2 PROFILE Fraunhofer FEP combines research and
Spectral and temporal control of Q-switched solid-state lasers using intracavity MEMS
Spectral and temporal control of Q-switched solid-state lasers using intracavity MEMS A. Paterson a, R. Bauer a. R. Li a, C. Clark b, W. Lubeigt a, D. Uttamchandani a a University of Strathclyde, Dept.
MEMS REPORT 2 / 2014 FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS
FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS MEMS REPORT 2 / 2014 CONTENTS Light Path Controller in Fiber Optic Networks Optical Sensor Increases Spot Welding Efficiency in the Automotive Industry
HISTORY OF MICROELECTOMECHANICAL SYSTEMS (MEMS)
HISTORY OF MICROELECTOMECHANICAL SYSTEMS (MEMS) LIGA-micromachined gear for a mini electromagnetic motor [Sandia National Labs] History of MEMS Learning Module Unit Overview The inception of Microelectromechanical
Leica TCS CARS. Live Molecular Profiling Technical Documentation. Living up to Life
Leica TCS CARS Live Molecular Profiling Technical Documentation Living up to Life Microscopes Inverted Leica DMI6000 CS Microscope anti-vibration table Specification Vibration insulation Passive Z-drive
InvenSense Fabless Model for the MEMS Industry
InvenSense Fabless Model for the MEMS Industry HKSTP Symposium Aug 2016 InvenSense, Inc. Proprietary Outline MEMS Market InvenSense CMOS-MEMS Integration InvenSense Shuttle Program and Process MEMS MARKET
Optical Input / Output Considerations for Photonic Integrated Circuit Coupling & Packaging
Optical Input / Output Considerations for Photonic Integrated Circuit Coupling & Packaging Dan Neugroschl Chiral Photonics, Inc. Pine Brook, New Jersey USA T. J. Seok, et. al., "High Density Optical Packaging
SEMICONDUCTOR TECHNOLOGY -CMOS-
SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada 2011/12/19 1 What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails.
MEMS METROLOGY USING A STROBED INTERFEROMETRIC SYSTEM
XVII IMEKO World Congress Metrology in the 3rd Millennium June 22 27, 2003, Dubrovnik, Croatia MEMS METROLOGY USING A STROBED INTERFEROMETRIC SYSTEM Erik Novak, Der-Shen Wan, Paul Unruh, Michael Schurig
Building Your Own 2-Photon Microscope: Challenges, Advantages and Limitations
Building Your Own 2-Photon Microscope: Challenges, Advantages and Limitations Roberto Weigert, Ph.D. Chief, Intracellular Membrane Trafficking Section Oral and Pharngeal Cancer Branch NIDCR-NIH Building
OV µm Pixel Size Back Side Illuminated (BSI) 5 Megapixel CMOS Image Sensor
OmniVision OV5642 1.4 µm Pixel Size Back Side Illuminated (BSI) 5 Megapixel CMOS Image Sensor Circuit Analysis of the Pixel Array, Row Control, Column Readout, Analog Front End, and Pipelined A/D Converter
The future of microled displays using nextgeneration
The future of microled displays using nextgeneration technologies Introduction MicroLEDs (micro-light-emitting diodes) are an emerging display technology that, as the name implies, use very small LEDs
EE C247B ME C218 Introduction to MEMS Design Spring 2017
EE C247B ME C218 Introduction to MEMS Design Spring 2017 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture Module
21 rue La Noue Bras de Fer Nantes - France Phone : +33 (0) website :
21 rue La Noue Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr 2012 September - Version 1 Written by: Maher Sahmimi DISCLAIMER
Compact multichannel MEMS based spectrometer for FBG sensing
Downloaded from orbit.dtu.dk on: Oct 22, 2018 Compact multichannel MEMS based spectrometer for FBG sensing Ganziy, Denis; Rose, Bjarke; Bang, Ole Published in: Proceedings of SPIE Link to article, DOI:
SEMICONDUCTOR TECHNOLOGY -CMOS-
SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails. Currently,
Liquid Crystal Display (LCD)
Liquid Crystal Display (LCD) When coming into contact with grooved surface in a fixed direction, liquid crystal molecules line up parallelly along the grooves. When coming into contact with grooved surface
MICROELECTROMECHANICAL systems (MEMS)-
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 5, OCTOBER 2006 1209 Design, Fabrication, and Characterization of a High Fill-Factor, Large Scan-Angle, Two-Axis Scanner Array Driven by a Leverage
UV Nanoimprint Tool and Process Technology. S.V. Sreenivasan December 13 th, 2007
UV Nanoimprint Tool and Process Technology S.V. Sreenivasan December 13 th, 2007 Agenda Introduction Need tool and process technology that can address: Patterning and CD control Alignment and Overlay Defect
The Silicon Pixel Detector (SPD) for the ALICE Experiment
The Silicon Pixel Detector (SPD) for the ALICE Experiment V. Manzari/INFN Bari, Italy for the SPD Project in the ALICE Experiment INFN and Università Bari, Comenius University Bratislava, INFN and Università
IC TECHNOLOGY Lecture 2.
IC TECHNOLOGY Lecture 2. IC Integrated Circuit Technology Integrated Circuit: An integrated circuit (IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor
B-AFM. v East 33rd St., Signal Hill, CA (888)
B-AFM The B-AFM is a basic AFM that provides routine scanning. Ideal for scientists and educators, the B-AFM is capable of creating high-resolution topography images of nanostructures in standard scanning
Analog, Mixed-Signal, and Radio-Frequency (RF) Electronic Design Laboratory. Electrical and Computer Engineering Department UNC Charlotte
Analog, Mixed-Signal, and Radio-Frequency (RF) Electronic Design Laboratory Electrical and Computer Engineering Department UNC Charlotte Teaching and Research Faculty (Please see faculty web pages for
Advanced WLP Platform for High-Performance MEMS. Presented by Dean Spicer, Director of Engineering
Advanced WLP Platform for High-Performance MEMS Presented by Dean Spicer, Director of Engineering 1 May 11 th, 2016 1 Outline 1. Application Drivers for High Performance MEMS Sensors 2. Approaches to Achieving
Advancements in Acoustic Micro-Imaging Tuesday October 11th, 2016
Central Texas Electronics Association Advancements in Acoustic Micro-Imaging Tuesday October 11th, 2016 A review of the latest advancements in Acoustic Micro-Imaging for the non-destructive inspection
MSV-400 Microscope Scanning Vibrometer
MSV-400 Microscope Scanning Vibrometer POLYTEC MICROSCOPE SYSTEMS MSV-050 Manual Microscope Adapter MSV-100 Remote Controlled Microscope Adapter MSV-400 Microscope Scanning Vibrometer PMA-400 Planar Motion
Recent advances in optical MEMS devices and systems
Invited Paper Recent advances in optical MEMS devices and systems P. R. Patterson, D. Hah, M. M. C. Lee, J.C. Tsai, and M.C. Wu Electrical Engineering Department, University of California, Los Angeles
Nature Neuroscience: doi: /nn Supplementary Figure 1. Ensemble measurements are stable over a month-long timescale.
Supplementary Figure 1 Ensemble measurements are stable over a month-long timescale. (a) Phase difference of the 30 Hz LFP from 0-30 days (blue) and 31-511 days (red) (n=182 channels from n=21 implants).
Lecture 26 Optical Coherence Tomography
EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 26 Optical Coherence Tomography Agenda: Reference Optical Delay Scanning MEMS-Based OCT References: Bouma and Tearney, Handbook of
An Overview of the Performance Envelope of Digital Micromirror Device (DMD) Based Projection Display Systems
An Overview of the Performance Envelope of Digital Micromirror Device (DMD) Based Projection Display Systems Dr. Jeffrey B. Sampsell Texas Instruments Digital projection display systems based on the DMD
A pixel chip for tracking in ALICE and particle identification in LHCb
A pixel chip for tracking in ALICE and particle identification in LHCb K.Wyllie 1), M.Burns 1), M.Campbell 1), E.Cantatore 1), V.Cencelli 2) R.Dinapoli 3), F.Formenti 1), T.Grassi 1), E.Heijne 1), P.Jarron
sensors ISSN
Sensors 009, 9, 619-631; doi:10.3390/s9080619 OPEN ACCESS sensors ISSN 144-80 www.mdpi.com/journal/sensors Article Manufacture of Micromirror Arrays Using a CMOS-MEMS Technique Pin-Hsu Kao 1, Ching-Liang
series PXY AP compact 2-axis translation stages
compact 2-axis translation stages series PXY AP variable travel range selection per axis based on VTRselect - concept extremely flat design for microscopy XY-motion up to 700 x 700 µm bi-directional actuating
Uncooled amorphous silicon ¼ VGA IRFPA with 25 µm pixel-pitch for High End applications
Uncooled amorphous silicon ¼ VGA IRFPA with 25 µm pixel-pitch for High End applications A. Crastes, J.L. Tissot, M. Vilain, O. Legras, S. Tinnes, C. Minassian, P. Robert, B. Fieque ULIS - BP27-38113 Veurey
The hybrid photon detectors for the LHCb-RICH counters
7 th International Conference on Advanced Technology and Particle Physics The hybrid photon detectors for the LHCb-RICH counters Maria Girone, CERN and Imperial College on behalf of the LHCb-RICH group
Micro-Electro-Mechanical Systems MEMs Sensors: Market Strategies and Forecasts, Worldwide,
Micro-Electro-Mechanical Systems MEMs Sensors: Market Strategies and Forecasts, Worldwide, 2018-2024 Table of Contents Micro-Electro-Mechanical Systems MEMs Sensors: Executive Summary The study is designed
Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities
Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities Evan Patton Semicon Europa November 2017 Lam Research Corp. 1 Presentation Outline The Internet of Things (IoT) as a market
Dynamic IR Scene Projector Based Upon the Digital Micromirror Device
Dynamic IR Scene Projector Based Upon the Digital Micromirror Device D. Brett Beasley, Matt Bender, Jay Crosby, Tim Messer, and Daniel A. Saylor Optical Sciences Corporation www.opticalsciences.com P.O.
A Review On Variable MEMS Mirrors For Photo-Lithographic Masks
APJES I-I (2013) 7-14 7 A Review On Variable MEMS Mirrors For Photo-Lithographic Masks Mehmet Akif Erişmiş Necmettin Erbakan Üniversitesi Electrical and Electronics Engineering Department Address: Necmettin
Applications. l Image input devices l Optical sensing devices
IMAGE SENSOR CMOS linear image sensor S8377/S8378 series Built-in timing generator and signal processing circuit; single 5 V supply operation S8377/S8378 series is a family of CMOS linear image sensors
Atlas Pixel Replacement/Upgrade. Measurements on 3D sensors
Atlas Pixel Replacement/Upgrade and Measurements on 3D sensors Forskerskole 2007 by E. Bolle erlend.bolle@fys.uio.no Outline Sensors for Atlas pixel b-layer replacement/upgrade UiO activities CERN 3D test
Introduction to. Micragem: A Silicon-on-Insulator Based Micromachining Process. Report ICI-138 V3.0 (Beta version)
Introduction to Micragem: A Silicon-on-Insulator Based Micromachining Process Report ICI-138 V3.0 (Beta version) December 14, 2004 Copyright 2004 Canadian Microelectronics Corporation This document was
High performance Uncooled amorphous silicon IRFPA with 17µm pixel-pitch
2.1 High performance Uncooled amorphous silicon IRFPA with 17µm pixel-pitch J.L Tissot, S. Tinnes, A. Durand, C. Minassian, P. Robert, M. Vilain ULIS BP27-38113 Veurey-Voroize, FRANCE ABSTRACT The high
Supplementary Figure 1. OLEDs/polymer thin film before and after peeled off from silicon substrate. (a) OLEDs/polymer film fabricated on the Si
Supplementary Figure 1. OLEDs/polymer thin film before and after peeled off from silicon substrate. (a) OLEDs/polymer film fabricated on the Si substrate. (b) Free-standing OLEDs/polymer film peeled off
Monolithic Optoelectronic Integration of High- Voltage Power FETs and LEDs
Monolithic Optoelectronic Integration of High- Voltage Power FETs and LEDs, Zhongda Li, Robert Karlicek and T. Paul Chow Smart Lighting Engineering Research Center Rensselaer Polytechnic Institute, Troy,
Comparison of SONY ILX511B CCD and Hamamatsu S10420 BT-CCD for VIS Spectroscopy
Comparison of SONY ILX511B CCD and Hamamatsu S10420 BT-CCD for VIS Spectroscopy Technical Note Thomas Rasmussen VP Business Development, Sales, and Marketing Publication Version: March 16 th, 2013-1 -
Solid State Photon-Counters
Solid State Photon-Counters GMAPD (Geiger Mode Avalanche PhotoDiode) SiPM (Silicon Photo-Multiplier) Single element Photon Counter Multi Pixel Photon Counter 1-cell n-cells charge = k charge = nk Giovanni
IoT Technical foundation and use cases Anders P. Mynster, Senior Consultant High Tech summit DTU FORCE Technology at a glance
IoT Technical foundation and use cases Anders P. Mynster, apm@force.dk Senior Consultant High Tech summit DTU 2017 FORCE Technology at a glance Internet of Things devices everywhere! Gartners Hype cycle
A High-Speed CMOS Image Sensor with Column-Parallel Single Capacitor CDSs and Single-slope ADCs
A High-Speed CMOS Image Sensor with Column-Parallel Single Capacitor CDSs and Single-slope ADCs LI Quanliang, SHI Cong, and WU Nanjian (The State Key Laboratory for Superlattices and Microstructures, Institute
Pressure sensor. Surface Micromachining. Residual stress gradients. Class of clean rooms. Clean Room. Surface micromachining
Pressure sensor Surface Micromachining Deposit sacrificial layer Si PSG By HF Poly by XeF2 Pattern anchors Deposit/pattern structural layer Etch sacrificial layer Surface micromachining Structure sacrificial
EXPRESSION OF INTREST
EXPRESSION OF INTREST No. IITDh/GA/CRF/2018-2019/02 EXPRESSION OF INTEREST (EoI) FOR PROCUREMENT of HIGH RESOLUTION ATOMIC FORCE MICROSCOPE (AFM)/SCANNING PROBE MICROSCOPE AS PER ANNEXURE-I 1. Introduction
Perfecting the Package Bare and Overmolded Stacked Dies. Understanding Ultrasonic Technology for Advanced Package Inspection. A Sonix White Paper
Perfecting the Package Bare and Overmolded Stacked Dies Understanding Ultrasonic Technology for Advanced Package Inspection A Sonix White Paper Perfecting the Package Bare and Overmolded Stacked Dies Understanding
PRODUCT GUIDE CEL5500 LIGHT ENGINE. World Leader in DLP Light Exploration. A TyRex Technology Family Company
A TyRex Technology Family Company CEL5500 LIGHT ENGINE PRODUCT GUIDE World Leader in DLP Light Exploration Digital Light Innovations (512) 617-4700 dlinnovations.com CEL5500 Light Engine The CEL5500 Compact
The Alice Silicon Pixel Detector (SPD) Peter Chochula for the Alice Pixel Collaboration
The Alice Silicon Pixel Detector (SPD) Peter Chochula for the Alice Pixel Collaboration The Alice Pixel Detector R 1 =3.9 cm R 2 =7.6 cm Main Physics Goal Heavy Flavour Physics D 0 K π+ 15 days Pb-Pb data
Nonlinear optical crystals for use in consumer laser projection displays. Dieter Jundt, Crystal Technology, Inc.
Nonlinear optical crystals for use in consumer laser projection displays Outline Motivation for laser projection Basic components used in LP Light generation Scanning/Modulation Green laser challenges
Electron Beam Technology
Electron Beam Technology Speed up! High Performance Electron Beam Lithography dedicated electron beam lithography To bridge cutting-edge research and nanofabrication, a dedicated nanolithography solution
Solid State Devices 4B6
Solid State Devices 4B6 Lecture 13 Projection and 3D displays: LCD, DLP and LCOS Daping Chu Lent 2016 Development of flat panel displays (FPDs) (LCD) in early days 1 A 105 inch TFT-LCD 4k2k curved panel
Spatial Light Modulators
Spatial Light Modulators XY Series - Complete, all-in-one system Spatial Light Modulators A spatial light modulator (SLM) is an electrically programmable device that modulates light according to a fixed
3D-CHIP TECHNOLOGY AND APPLICATIONS OF MINIATURIZATION
3D-CHIP TECHNOLOGY AND APPLICATIONS OF MINIATURIZATION 23.08.2018 I DAVID ARUTINOV CONTENT INTRODUCTION TRENDS AND ISSUES OF MODERN IC s 3D INTEGRATION TECHNOLOGY CURRENT STATE OF 3D INTEGRATION SUMMARY
FAST, MEMS-BASED, PHASE-SHIFTING INTERFEROMETER 1
FAST, MEMS-BASED, PHASE-SHIFTING INTERFEROMETER 1 Hyuck Choo 2, Rishi Kant 3, David Garmire 2, James Demmel 2, and Richard S. Muller 2 2 Berkeley Sensor & Actuator Center, University of California, Berkeley,
FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect. MEMS Packaging
FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect MEMS Packaging Lecture topics Introduction to MEMS packaging concerns: Why MEMS packaging are more challenging than IC packaging
Organic light emitting diode (OLED) displays
Ultra-Short Pulse Lasers Enable Precision Flexible OLED Cutting FLORENT THIBAULT, PRODUCT LINE MANAGER, HATIM HALOUI, APPLICATION MANAGER, JORIS VAN NUNEN, PRODUCT MARKETING MANAGER, INDUSTRIAL PICOSECOND
Projection Displays Second Edition
Projection Displays Second Edition by Matthew S. Brennesholtz Insight Media, USA Edward H. Stupp Stupp Associates, USA WILEY A John Wiley and Sons, Ltd, Publication Contents Foreword Preface to the Second
The software concept. Try yourself and experience how your processes are significantly simplified. You need. weqube.
You need. weqube. weqube is the smart camera which combines numerous features on a powerful platform. Thanks to the intelligent, modular software concept weqube adjusts to your situation time and time
9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr January 2012 Written by: Maher SAHMIMI DISCLAIMER :
MEMS / MOEMS. Stand und Perspektiven
MEMS / MOEMS Stand und Perspektiven Hubert Lakner Institute for Photonic Microsystems (IPMS Dresden) Technische Universität Dresden Prof. for Optoelectronic Devices and Systems IPMS-Budget (in Mio ) 25
Layout Analysis Analog Block
Layout Analysis Analog Block Sample Report Analysis from an HD Video/Audio SoC For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685
Integrated Circuit Design ELCT 701 (Winter 2017) Lecture 1: Introduction
1 Integrated Circuit Design ELCT 701 (Winter 2017) Lecture 1: Introduction Assistant Professor Office: C3.315 E-mail: eman.azab@guc.edu.eg 2 Course Overview Lecturer Teaching Assistant Course Team E-mail: