Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities

Transcription

1 Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities Evan Patton Semicon Europa November 2017 Lam Research Corp. 1

2 Presentation Outline The Internet of Things (IoT) as a market driver for IC demand The resurgence of 200 mm demand and challenges from a capital equipment perspective Need for leading-edge (300 mm) technology even for IoT applications Enabling solutions for IoT applications Summary Lam Research Corp. 2

3 IoT Installed Base, Global Market (Billions) The Internet of Things Market is Growing Networked Society Networked Consumer Electronics Networked Industries Significant growth in IoT devices Most only need 28nm process capability 1) Source: IHS, 2016 Lam Research Corp. 3

4 Enabling Technologies for IoT Applications New Materials IOPScience Piezoelectric Wide Band Gap 1 New transducer and power devices Controlled Etch High accuracy, low power Deep Si Etch FD-SOI Through-Silicon Via Smaller footprint System in Package (SIP) 3D 1 Baker, R.; Milligan, J.;, Wood, S.; Comparing GaN-on-SiC Power Transistor Technology with GaAs and Si. Wireless Design and Development Lam Research Corp. 4

5 300 mm Deposition and Etch Processes Market Leaders in 3D NAND Memory Array Single Memory Cell Bitline: Metal fill SABRE copper plating VECTOR Strata deposition Stack: Alternating film deposition Contact: Metal fill ALTUS CVD/ALD deposition Flex HAR etch Slit: High aspect ratio etch Channel: High aspect ratio etch Flex HAR etch Wordline: Metal fill ALTUS CVD/ALD deposition Stair: Staircase etch Kiyo conductor etch Features enabling 3D NAND at 300 mm enable IoT devices Lam Research Corp. 5

6 MEMS Devices Challenges and Solutions Deposition-Enabled Cavity Seal High deposition Rate SPEED HDP Low pressure (<50mT) high quality oxide film ~5µm thick SiN Membrane Excellent film stress required for membrane layers in pressure sensors and microphones SEQUEL PECVD Cavity Etch High Etch Rate Good profile control DSiE-G Si Etch Buried Oxide Etch Accurate, uniform temperature control High etch rate High selectivity No Silicon attack Flex45 Dielectric Etch MEMS Si Structure Etch Tilt minimization & profile control Controllable CD & depth uniformity DSiE-G Si Etch Profile tunability taper, vertical, and re-entrant Single Side Wet Processing Cost effective residue, particle and film removal Precise wafer thinning / stress relief Controlled metal structuring SP and DaVinci Single Wafer Etch Rapid Innovation in MEMS Industry Requires focus and new solutions in Equipment & Technology Lam Research Corp. 6

7 IoT also Requires Predictable Production Solutions Continue to build new systems for both 200 mm and 300 mm fabs Supply of advanced 200 mm systems is not dependent on used core availability Allows customers to plan fab ramps with reduced risk Ensure tools are available to support next-generation technology The average age of Lam Alliance product family tools is 15 years, with over 20% more than 20 years old New processes New materials Productivity solutions Parts availability for the aging tool set through structured obsolescence management Maintain skilled resources Tool expertise Process expertise Lam Research Corp. 7

8 Tech Eng Productivity Solutions--Alliance C and Advanced Software Alliance C Extends the useful life Brings 300 mm learning to 200 mm systems Enables Advanced Software System upgrade based on Lam s leading-edge 2300 platform System UI Transfer and Process Module Control System AutoPM Throughput Optimization (TPO) Distributed UI LamDA Wet Clean Optimization (WCO) 33% Improvement in G2G time and 45% reduction in labor time Advanced Software Example Results with Wet Clean Optimization 75 hrs Before WCO 50 hrs With WCO Step-bystep tracking Eng AutoPM Tech 80% Reduction in Unscheduled Cleans Time Between Cleans (TBC) WCO No WCO Local language video Lam Research Corp. 8

9 Summary Advanced Technology MEMS Industry Technology CIP of IoT Equipment The Internet of Things market is growing New IoT devices will need enabling technologies Strength in leading edge devices such as 3D NAND provides enabling technology for IoT devices Continued significant investment in products for > 28 nm (e.g. obsolescence) extends the useful life of IoT fab equipment Good obsolescence solutions can provide IoT manufacturers with the same advanced software tools as leading-edge customers Lam Research Corp. 9

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