2016 Media Kit.

Transcription

1 2016 Media Kit

2 Cotact Iformatio MEPTEC HOME OFFICE 315 Savaah River Dr., Summerville, SC Bette Cooper / Presidet Fax: Toll free bcooper@meptec.org Gary Brow / Director of Operatios Fax: Toll free gbrow@meptec.org SALES Gia Edwards / Sales Maager Fax: Toll free gedwards@meptec.org

3 Cotets About MEPTEC 1 Advertisig Opportuities MEPTEC Report Newsletter 2 Distributio 3 Advertisig Rates ad Deadlies 4 Advertisig Specificatios 5 Techitorials 6 1/6 Page Ad Artwork Productio Services 7 Marketig Opportuities Web Baer Advertisig 8 Baer Advertisig 9 MEPTEC Evet Sposorship 10 MEPTEC Evet Exhibitig Opportuities 11

4 Your Microelectroic Package Assembly Solutio for MEMS Sesors About MEPTEC MEPTEC (Microelectroics Packagig ad Test Egieerig Coucil) is a trade associatio of semicoductor compaies ad professioals ivolved i the maufacturig, packagig, assemblig ad testig of itegrated circuits. Sice its iceptio 35 years ago, MEPTEC has provided a forum for the semicoductor idustry to lear ad exchage ideas through our mothly lucheos, cofereces, ad our quarterly publicatios, the MEPTEC Report. With the help support of a Advisory Board cosistig of idividuals from all segmets of the idustry, MEPTEC has, over the years, kept curret ot just with with ot just semicoductor idustry developmets, but has expaded its scope to cover relevat idustry segmets such as MEMS ad medical electroics. Your Microelectroic Package Assembly Solutio for MEMS Sesors Closig the MEMS Sesor Product Life Cycle Gap from Developmet to Productio MICROELECTRONIC PACKAGE assembly is a key part of the $16.5B commercial MEMS sesor market represetig 22% of the market. I terms of uit growth, the MEMS microelectroic package assembly market is growig twice as fast as the IC package assembly market, but the eeds of the etire life cycle of a MEMS product are ot met. From developmet of iitial maufacturig processes ad materials selectio, to prototype developmet, to evirometal life test qualificatio, to volume productio, SMART Microsystems provides the lowest overall developmet time ad cost to satisfy the full life cycle requiremets of MEMS sesor products. Relatively commo MEMS devices such as pressure, chemical, ad optical sesors require custom package developmet whe beig itegrated ito a sub-assembly for iche applicatios. Ad while may service providers (who focus o microelectroic package assembly of ICs) ofte uderestimate MEMS sesor developmet projects, SMART Microsystems focuses o microelectroic package assembly of MEMS sesor products to appropriately scope projects. This reduces delays ad icreases the ability to solve complicated process issues. SMART Microsystems provides compaies throughout the Uited States ad Caada with MEMS sesor prototypes ad has successfully brought several ew developmet programs to productio readiess. Customers iclude producers, maufacturers, ad suppliers who require microelectroic sub-assemblies for sesor products. With expertise ad a focus o MEMS sesor products, the SMART Microsystems egieerig team has solved may MEMS process challeges ad uderstads the uaces of MEMS sesor product developmet eeds. Located i Norther Ohio, SMART Microsystems opeed a ew facility with over 15,000 square feet of ISO 6 (class 1000) ad ISO 5 (class 100) clearooms. This state of the art facility, furished with flexible equipmet capabilities for assemblig a high mix of materials ad products, creates a tur-key solutio for microelectroic package assembly of MEMS sesors. From prototypig all MEMS Product Life Cycle Captured at SMART Microsystems. the way through market etry, SMART Microsystems is a sigle supplier, reducig the total cost of product developmet. Prototype developmet ad maufacturig capabilities iclude dicig, die attach/flip chip, vacuum solder reflow, wire bodig (ball ad fie/heavy gauge wedge with both wire ad ribbo) ad ecapsulatio (adhesive dispese, lid seal ad parylee coatig). Evirometal life testig capabilities at SMART Microsystems iclude HAST, thermal shock, thermal/humidity cyclig, high temperature storage ad accelerated UV durability. Advaced ispectio equipmet is comprised of a acoustic microscope, 3D X-ray, iterferometer ad a scaig electro microscope (SEM). Equipmet capabilities at SMART Microsystems deliver maufacturable ad sustaiable solutios. As a certi- fied ISO-9001 maufacturer, SMART Microsystems icorporates desig-formaufacturig ito the iitial stages of developmet this decreases process iteratios ad reduces time eeded as the product moves ito volume productio. By workig cocurretly with the customer s desig team ad suppliers, SMART Microsystems is able to implemet process specificatios, desig-tocost goals, ad o-time delivery objectives efficietly, reducig overall time ad cost. SMART Microsystems applies this approach to aerospace, idustrial, medical, ad other markets ad supports the package format QFN, DIP, TO-ca, chip-o-board, flip chip, or custom housigs that is eeded for the applicatio. I all situatios, icorporatig maufacturig objectives early reduces the developmet time ad cost, eablig SMART Microsystems to scale-up quickly, support volume productio, ad meet quality assurace requiremets. SMART Microsystems is located ear Clevelad, i a Midwest maufacturig hub. Nearby access to a iteratioal airport allows for fast ad easy trasportatio to support medical, aerospace ad other markets that require the high-value, low-volume applicatios for MEMS sesors. With a focus o MEMS package assembly ad a certified ISO-9001 status, SMART Microsystems creates the turkey solutio for customers. Accomplishig the full life cycle requiremets of MEMS sesor products, SMART Microsystems takes a desig from prototype, through qualificatio, to volume productio at the lowest overall developmet time ad cost. More iformatio about SMART Microsystems services ca be foud at 24 MEPTEC REPORT WINTER 2015 meptec.org Idustrial Cotrols Medical Applicatios The SMART Advatage. Lowest Overall Developmet Time ad Cost SMART PROTOTYPE DEVELOPMENT As a tur-key solutio, SMART Microsystems builds early proof-of-cocept samples as well as feasibility studies to help you avoid challeges that appear early i process developmet. SMART Microsystems egieerig team s expertise i MEMS sesor products has solved may of these challeges. SMART ENVIRONMENTAL LIFE TEST SMART Microsystems evirometal life testig idetifies reliability issues early i your MEMS sesor product developmet. As part of a tur-key solutio, reliability study, or o a as-eeded basis for overflow/badwidth, SMART Microsystems ca solve your issues before they become a problem i the field. SMART MANUFACTURING SERVICES With the SMART Microsystems ivestmet i state-of-the-art facilities ad a experieced team, we are able to scale-up maufacturig quickly, support low-volume productio, ad meet your quality assurace requiremets. SMART Microsystems creates tur-key solutios for microelectroic package assembly challeges to move your MEMS sesor techology from developmet to productio. With a egieerig team experieced i maufacturig ad state-of-the-art facilities, SMART Microsystems accelerates the trasitio of your ew MEMS sesor product to the market. Call us today at or visit our website at for more iformatio about SMART Microsystems capabilities ad services. 141 Iovatio Drive, Elyria, Ohio ifo@smartmicrosystems.com Aerospace Systems 1

5 Figure 6. 1st Bod (Al-splash). Figure 7. Wire Resistivity Comparisos. Category Resistivity Reliability Chip Damage 1st Bodability 2d Bodability Bodig Eviromet Figure 8. Summary of Wires. Atomic Symbol: Physical Properties Resistivity (u Ω cm) Thermal Coductivity (W/m k) Meltig Poit (k) Yougs Modulus (GPa) Figure 9. Wire Properties Summary. Au Wire Ag Wire Bare Cu Wire Pd Coated Cu Wire Figure 10. Material Cost Summary. Pd Coated Cu Low High High Good Good N2H2N2 Ag Alloy High High Low Best Good N2 Au N Au Medium High Low Best Good Air Ag N Cu Low Medium Medium Good Poor N2H2 Cu Figure 11. Beefits of Ag Alloy Wire. 1 Abudace: 2012 book by Peter Diamadis ad Steve Kotler, defiig abudace as elimiatio of global problems such as huger, lack of medical care, eergy, water ad ucotrolled populatio growth through expoetial techologies, which iclude sesors. Packages ot show at actual size Amkor Techology, Ic. Microphoe, Pressure, Humidity/Temperature, Gyroscope, Accelerometer, Figerprit, Light, Ifrared ad Fusio Sesors MEPTEC Report Newsletter The MEPTEC Report is published four times per year as a service to MEPTEC members ad supporters. The full color publicatio features articles o cuttig edge techology, guest editorials, idustry developmets, ad other ews applicable to major issues surroudig the world of semicoductor assembly ad test. Our primary goal has bee to make the MEPTEC Report a marketig tool for MEPTEC member compaies. Priority coverage is give to member compaies products, services, ad techology developmet. Advertisig i the MEPTEC Report is very cost effective whe compared to other trade jourals, ad reaches a very targeted audiece of loyal readers. With the additio of a digital editio the MEPTEC Report reaches a ever icreasig audiece. MATERIALS OPINION to PCC wire, it has a simpler productio process ad better first bodability due to softer FAB ad less Alumium splash. Alumium splash comparisos betwee Silver alloy wire ad PCC wire ca be see i Figure 6. Silver wire will ot be a drop-i replacemet for PCC wire, ad the electrical requiremets ad bod pad structure must be evaluated as the weakess of Silver alloy wire is higher electrical resistivity. Sice Silver alloy wire resistivity is higher tha Copper, PCC or Gold, potetial users must determie whether the resistivity will support the electrical requiremets of their specific applicatios. It should be oted, the wire suppliers are workig to further improve ad lower the wire resistivity of Silver alloy wire closer to Gold wire. Wire resistivity comparisos ca be see i Figure 7. The mai drivers today of Silver alloy bodig wire are cost savigs, with secodary focus for performace MAKE PLANS TO ATTEND TODAY... (Bodig Coditio) Search Level: 120µm Boder: Shikawa UTC-1000 Search Speed: 8.0mm/s Gas: N2 0.6 l/mi. Search Force: 40gf Die-Pad: Al-0.5% Cu (t=0.8µm) Bod Force: 40gf Capillary: SPT SI (H:25, T:130, CD:38, FA:8, OR:30) US-Power: 170~230 Wire Diameter: 20µm US-Mode: -2 FAB Diameter: 38µm Pre US-Power: 40 Bod Time: 6.0ms US-Power 170 US-Power 200 US-Power 260 Ag Pd Coated Cu Wire 3D Architectures for Semicoductor Itegratio ad Packagig 3D ASIP December 11-13, 2013, Burligame, Califoria The Techology ad Market Ladscape for Device This coferece provides a uique perspective of the techobusiess aspects of the emergig ad Systems Itegratio ad Itercoect commercial opportuity offered by 3-D itegratio ad packagig combiig techology with busiess, research developmets with practical isights to offer idustry leaders the iformatio eeded to pla ad move forward with cofidece. For more iformatio visit: 26 MEPTEC REPORT FALL 2013 meptec.org Resistivity (µ? cm) 4-Poit Probe Measuremet Method R = V/I (R: Resistace V: Voltage I: Curret) ρ = R x S/L (ρ: Resistivity S: Sectioal Area L: Legth) % Au 99.9% Au 99.99% Au 99.99% Cu Ag Alloy Wire Bod Material meptec.org ad reliability improvemet. It is fairly easy to switch from Gold wire ad Copper wire sice Silver alloy wire oly requires safe ad iexpesive itroge gas which is readily available i existig maufacturig ifrastructure. Also sice Silver alloy wire has a similar level of productivity as Gold wire ad sufficiet secod bod adhesio uder almost the same bodig coditios as Gold wire. Silver alloy wire shows good potetial as it offers several advatages compared to covetioal Copper ad PCC wires; maily, excellet bodig performace ad reliability. A Wire compariso table ad physical property summary ca be see i Figures 8 ad 9. To summarize the beefits of switchig from Copper wire to Silver wire is that Silver wire ca meet ball bodig performace requiremets, has soft FAB ad excellet low loop formatio while maitaiig productivity o par with Gold wire. Silver bodig wire has good elogatio ad breakig load properties with o existet workhardeig process issues like copper wire. (See Figure 11.) I coclusio it is importat to ote, Silver alloy wire may ot work for all applicatios but it ca certaily help support may applicatio areas where cost ad performace defie a product. Silver wire usage is expected to icrease i the ext few years i both the LED ad semicoductor idustries. For Customer Usig 4N Au Wire Similar 2d Bodability - Wide 2d Bod Process Widow - Comparable Stitch Pull Stregths Good Reliability - Loger HTS Life Cost Savigs For Customer Usig Rd Coated Cu Wire Similar Cost - More Simplified Productio Process Better 1st Bodability - Less Al Splash FALL 2013 MEPTEC REPORT 27 A Trillio Sesors i a Decade Jobs, Jobs, Jobs ad more Jausz Bryzek, Ph.D. Vice Presidet, MEMS ad Sesig Solutios Fairchild Semicoductor IN 2010 I WAS A CO-ORGANIZER OF tides such as Abudace 1, Mobile Health, has bee betwee 2 ad 4 (depedig a evet called the MEMS Techology Iteret of Thigs, Cotext Computig o regio). Assumig coservatively a Summit that was held at Staford Uiversity. At the evet attedees heard a talk that Post-processig the outlied visio- may idirect jobs, for a total of 41 millio ad others. estimate of 2, this would result i twice as preseted a visio for 7 trillio sesory ary applicatios to extract sesor types, ew direct ad idirect jobs i developed swarms by This triggered me to supportig those which would require the coutries. explore high sesor growth opportuities which resulted i a log research that i a published TSesors Roadmap. 1.3M ew jobs betwee 2002 ad 2012, developmet acceleratio effort, resultig As a referece, the US created oly ucovered multiple poiters to the possibility of a trillio sesors i the comig o developig the acceleratio strategy for tors. Formatio of workig groups focused primarily i Govermet ad medical sec- decade. eeded high volume sesor types. As sesor based systems require a hightech work force, the majority of created What was iterestig is that the leadig Executig the acceleratio strategy, market research orgaizatios did t yet which will likely require fudig of the jobs will likely be for kowledge workers. A example of a sesor based system see such growth potetial. This remided cooperative effort betwee academia, me of 2007, whe the explosio of gyroscopes was ot forecasted. I came to a cosors ad the required high volume mau- followig breakdow of 2011 sellig price: idustry ad Govermets, to develop se- could be Apple s iphoe 4s, which had the clusio, that oly visioaries ca ivet facturig ifrastructure eablig low cost 3% ($14) assembly (Chia) ew applicatios comig to the market (desig tools, maufacturig processes ad 32% ($178) compoets (global) with a ultrahigh demad for sesors. tools, packagig, testig, etc.). 66% ($368) Apple s share (US) Based o the success of the 2010 Summit, Oe of the extremely positive potetial 100% ($560) sellig price I decided to ask leadig sesor visioaries to preset their visios at the TSesors be the expoetial sesor market growth model holds for emergig sesor based results of this iitiative, if materialized, will If the iphoe maufacturig/sales (Trillio Sesor) Summit at Staford Uiversity to be held o October Over Let s assume a average reveue be for kowledge workers located i the resultig i massive creatio of ew jobs. systems, most of the geerated jobs would 40 visioaries have agreed to talk. per employee i developed coutries at developed atios. TSesors implemetatios thus have a potetial to overshadow Time to market for ew sesor techologies historically averaged over 20 ad $500,000/year (equal to the 2011 aver- most other job creatig approaches co- $250,000/year for compoet compaies years from academic prototypes to high age for the US Nasdaq 100 compaies) sidered by Govermets. It may also force volume productio. Based o my MEMS for smart systems compaies. Let s further Govermets of differet coutries to compete for these jobs. startups experiece, I believe that accelerated sesor developmet to support growth wireless sesor ode at $0.13 i trillio Oe of the most rewardig effects of assume a average sellig price of the of the sesor market to trillios is possible, uits/year volumes, cumulatively represetig 0.1% of forecasted 2023 global global advacemets ad improvemets a trillio sesors will be life-chagig but requires a focused commercializatio effort. This belief was reiforced by a GDP. This would the represet a $130 addressig the world s biggest problems, BSAC/UC Berkeley presetatio by Vijay billio 2023 reveue level, traslatig to such as huger, lack of medical care, pollutio, lack of water ad eergy, as well as Ullal (ow Presidet, Fairchild Semicoductor) callig for creatio of Coopti- Systems eabled by sesors (iclud- improvemet of quality of life for all. 520,000 ew direct jobs. tio, or cooperatig competitors, joitly ig hardware, software, data processig, Joi us at the TSesors Summit to fudig developmet of stadard MEMS data storage, etc.) will create much higher watch the revolutio ufold! Visit www. processes ecessary to support accelerated reveue. So far, sesor cost i very high tsesorssummit.org for details. growth of MEMS markets from $10B to volume mobile applicatios averages about Cotact bcooper@tsesorssummit.org a already visible $300B. 2% of the system ASP. Assumig this ratio or call if you have questios. Our visio is that the sesor developmet acceleratio will require the follow- create 50 times higher reveue, or $6.5 holds, systems eabled by sesors would ig steps: trillio. This would create 13 millio ew Ivetio of ew sesor applicatios likely to eter a ultra high volume Typically, the job multiple for idirect direct jobs. demad resultig from emergig global jobs resultig from kowledge workers 38 MEPTEC REPORT FALL 2013 meptec.org CABGA/FBGA fccsp or MLF PMIC TMV PoP PMIC Audio Codec Applicatio Processor Audio Codec Basebad Basebad Power Amplifier Camera Module Memory Touch Cotroller RF GPS SCSP LGA WLCSP Memory Power Amp PMIC Basebad RF Audio Codec RF Power Amplifier Compass Visit Amkor Techology olie for the most curret product iformatio ad locatios. FC M BGA fccsp Graphic Processor PMIC Combo Chip Sesor Packages Cavity MEMS LGA MLF Cotact: gedwards@meptec.org 2

6 MEPTEC Report Distributio Prit copies of the MEPTEC Report are distributed directly to all MEPTEC members. Additioally, thousads of bous copies are distributed at major idustry evets throughout the year. The MEPTEC Report is also available as a digital publicatio distributed at o charge through the MEPTEC website. Bous Evet Distributio All MEPTEC Symposiums ad Lucheos APEX Expo & Coferece ECTC / Electroic Compoets ad Techology Coferece IMAPS Device Packagig Coferece & Exhibitio IMAPS Iteratioal Symposium o Microelectroics IWLPC / Iteratioal Wafer Level Packagig Coferece RTI 3D Architecture Coferece SEMICON West SMTA Iteratioal Expositio ad Coferece SMTA Pa Pacific Microelectroics Symposium & Exhibitio Cotact: gedwards@meptec.org 3

7 MEPTEC Report Advertisig Rates ad Deadlies Rates are effective with advertisig placed i the MEPTEC Report begiig Sprig 2016 Issue. Four Color Rates (per isertio) Stadard Rate Discouted Member Rate 2 page Techitorial Spread $2750 $2500 Full page $1815 $1695 2/3 vertical $1395 $1245 1/2 vertical or horizotal $1180 $1070 1/3 vertical or square $1025 $920 1/4 vertical $885 $770 1/6 vertical $350 $250 Black & White Rates (per isertio) Stadard Rate Discouted Member Rate Full page $1180 $1070 2/3 vertical $925 $820 1/2 vertical or horizotal $745 $645 1/3 vertical or square $595 $495 1/4 vertical $450 $345 Additioal Discouts A 15% discout will be allowed o pre-paid advertisig for four issues or more. Bleed Charges No charge for bleed o full-page, 2/3, 1/2 ad 1/3 page ads. Bleed ot available o 1/4 ad 1/6 page ads. Special Positios Special positios are available at a premium of 10% of the space rate ad iclude iside frot cover, iside back cover, ad back cover. Deadlies Sprig 2016 Issue Ad space close: 2/12 Materials due: 2/19 Summer 2016 Issue Ad space close: 5/13 Materials due: 5/20 Fall 2016 Issue Ad space close: 8/12 Materials due: 8/19 Witer 2016 Issue Ad space close: 11/18 Materials due: 11/25 Cotact: gedwards@meptec.org 4

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9 MEPTEC Report Techitorials A Techical Editorial Promote your products or services with this uique advertisig opportuity. Each MEPTEC Report issue will cotai a limited umber of techitorial features which will highlight differet aspects of techology relevat to assembly, packagig ad test. The feature will iclude a righthad placed full page, four-color advertisemet, ad a facig full page write-up. Priced at the low cost of $2,500.00, it is essetially two full pages of advertisig for the price of 1-1/2 pages. What is a Techitorial? A techitorial is a full page write-up provided by the advertisig compay that is a complemetary techical piece to the full page advertisemet, describig the compay s products or services, o-commercial i ature. It will educate ad iform the reader, yet will be subtly slated towards the compay s techology by beig placed ext to the compay s full page advertisemet. The article will ot metio the advertisig compay s ame, but a by-lie ad cotact iformatio will be allowed. Cotact Gia Edwards at gedwards@meptec.org for availability ad to place your order. 6

10 MEPTEC Report 1/6 Page Ad Artwork Productio Promote your products or services with a low cost 1/6 page four-color ad space i the MEPTEC Report. Rate icludes ad artwork, if eeded, created usig images provided by you (photo ad/ or compay logo) ad your text. Ad Rates (per isertio) 1/6 page Ad Stadard Rate $350 Discouted Member Rate $250 Additioal Discouts A 15% discout will be allowed o pre-paid advertisig for four issues or more. 1/6 Page Ad Specificatios 1/6 Page Ad artwork ca be produced at o additioal charge from materials supplied by advertisers. Advertiser should provide oe four-color image (either photo or compay logo) ad oe text file. Acceptable electroic formats are as follows: Photo image or logo files should be provided as eps, tiff, or jpeg files. Images should be at least 300 dpi at the fial desired prit size for best reproductio quality. Ad text should be approximately 75 words (or less) ad submitted as a Word documet. Please iclude your compay website URL for iclusio at bottom of ad. COLUMN COUPLING & CROSSTALK By Ira Feldma ELECTRONIC COUPLING IS THE trasfer of eergy from oe circuit or medium to aother. Sometimes it is itetioal ad sometimes ot (crosstalk). I hope that this colum, by mixig techology ad geeral observatios, is thought provokig ad couples with your thikig. Most of the time I will stick to techology but occasioal crosstalk diversios like this oe may deliver a message closer to home. Measurig Up SMT, COB, COF, IC ASSEMBLY SAME DAY, 1-5 DAYS TURN AmTECH is a leadig Silico Valley provider for SMT, COB, COF ad IC Assembly. Gold ball, alumium ad gold wedge wire bodig, Automated Optical Ispectio (AOI) ad XRAY. SMT ASSEMBLY, Lead-Free, 0201, ubga, CSP COB, COF, IC ASSEMBLY, Clearoom ISO 7 (Class 10,000), Alumium ad Gold wire NPI - PROTOTYPE, 8, 24 to 72 hours tur Low to Medium Volume PRODUCTION, MRP, IPC-A-610 Class 2 ad 3, MIL-STD-883 Your NPI Maufacturig Solutio! Phoe (408) ifo@amtechmicro.com TAP TO TURN ON. WAIT FOR it to zero. Step o. I have t lost ay weight, still 205 pouds eve with all this exercise ad careful eatig? Step off, step back o. 212 pouds. Dam, wrog aswer. Step off, step back o. 206 pouds. Okay maybe the first readig was right. Optimistically record 205 pouds. Does this ightly dace soud familiar? Not oly are bathroom scales the bearer of bad ews, their erratic behavior may make them oe of the most despised home appliaces. I caot say that the coversio of bathroom scales from purely mechaical systems to digital electroics has icreased their accuracy. The precisio of the data has icreased movig from coarse aalog dials to digital displays but scales do ot appear to have improved accuracy or repeatability. Eve though my scale displays weight to the earest 0.1 poud (precisio), the specified accuracy is oly +/- 0.2 pouds. May people, egieers icluded, ofte cofuse the precisio for the accuracy. (See my blog or this Wikipedia etry for a refresher o the differece betwee accuracy ad precisio.) I have t doe a aalysis of variace (ANOVA) gauge repeatability ad reproducibility (ofte shorteed to ANOVA gauge R&R or simply gauge R&R ) study of my bathroom scales ad measuremet techiques, but I just kow the R&R is awful. Perhaps this may be a good elemetary school sciece project for my childre? I ay case, it certaily is ot user error As a statistical process cotrol (SPC) chart jukie, I plot each of my measuremets by had i real-time. I m all for deep statistical aalysis of data, preferably i as close to real time as possible. There is ofte a sigificat delay betwee whe the measuremet is made ad whe the statistics are ru. By maually chartig key parameters at the time of measuremet, the user gais a feel for the data ad isight ito the stability of the process ad measuremet challeges. Beyod geeral optimism, I ca pick the most likely accurate value for my weight. The typical digital bathroom scale is based upo load cell techology where the resistace of a strai gauge chages due to the applied load. Four load cells are ofte coected i a Wheatstoe bridge cofiguratio whose resistace is the measured. From that resistace the strai ca be calculated kowig the geometry of the strai gauge. This is certaily ot terribly complex techology whe compared to moder microelectromechaical systems (MEMS) based sesors. However, there are plety of challeges i desigig ad producig a digital bathroom scale especially whe cosiderig the low average sellig price (ASP). Most MEMS based sesors measure fudametal forces acceleratio, rotatio, ad pressure usig miiature structures that move slightly. This movemet results i a miute chage to either capacitace or resistace that ca be measured with high sesitivity electroics ad used to calculate the movemet. These sesors i tur provide measuremets to calculate meaigful iformatio about objects such as: How fast is a automobile movig or turig? Are the tires iflated properly? Sesor fusio adds a layer of computatioal itelligece to combie the data from multiple sesors i order to icrease accuracy, elimiate spurious measuremets, ad provide greater isights ito what has just happeed. With my bathroom scale, I provide the itelligece to elimiate bad data. For iaimate objects, MEMS sesig is fairly straightforward ad accurate. But like measurig a perso s weight, measurig ad providig meaigful iformatio about people is sigificatly more complex. Did the wristbad sesor actually measure several steps or was the user wavig their arms? These measuremet challeges may be why some techologists differetiate types of sesors as off-body, o-body (wearable), ad i-body (implatable or digestible). 14 MEPTEC REPORT SPRING 2013 meptec.org Most successful MEMS sesors todate are off-body applicatios typified by automotive ad smartphoe applicatios. Eve though a user may wear a smartphoe, the data collected is more about the motio of the smartphoe tha the wearer. Not oly is obtaiig meaigful data easier i off-body applicatios, the devices may ot eed biocompatibility testig or medical regulatory approval. With few exceptios, may of the mass marketed MEMS based systems today have coarse accuracy sufficiet oly for sesig large chages. Coarse accuracy is sufficiet for idiot lights (such as low tire pressure), toys, ad gadgets. I ve oticed that my global positio system (GPS) watch ad sports measuremet applicatio o my smartphoe (usig sesor fusio of GPS ad MEMS sesors combied with map data) are always slightly off i terms of distace for my bicycle rides. Ad either measures exactly the same as my wheel based odometer. The distace differece o these devices is mior compared to the ~2x differece i vertical climbig ad ~3x differece betwee calculated calories. I could probably desig a gauge R&R study ad calibratio method betwee the devices for distaces, possibly for vertical climbig, but what about the calorie differece? As much as I am iterested i improvig my physical performace, perhaps I am better off ejoyig my bike ride ad the half-gallo of ice cream that the high calorie expediture data permits. As the demad for self-awareess ad quatificatio devices such as activity moitors ad calorie couters grows, a greater umber of ethusiasts are likely to push for icreased accuracy. As MEMS sesor techology improves, market-leadig product compaies will fid it easier to supply high accuracy ad repeatable devices at reasoable costs. I look forward to the day whe all of my devices have a much higher degree of correlatio to each other. As applicatios move to o-body or i-body their sophisticatio, accuracy, repeatability, ad reliability eed to icrease sigificatly. This will permit may of the devices that are curretly closer to toys ad gadgets to become better diagostic tools. The desire for self-admiistered medical diagostics, ofte evisioed usig a smartphoe as the computig ad coectivity egie, comes with sigificat system performeptec.org mace challeges. These devices may start out as idiot lights for our body i.e. time to see the doctor for check egie but greater specificity to provide medical grade measuremets will be demaded over time. System accuracy ad repeatability will be essetial to detect acute symptoms ad prevet false positives. Oce medical or missio critical reliability is prove for more tha a hadful of devices, MEMS will quickly move from o-body to i-body applicatios. At the same time MEMS has the opportuity to move from measuremet to iteractio. The uique size of MEMS may eable multiple measuremet poits ad/or ew therapeutic methods. High volume MEMS fabricatio processes ad packagig techologies that lower costs will icrease the adoptio rate of home or idividual cetric poitof-care. This greater access to advaced automated healthcare i o-cliical settigs should reduce out-of-cotrol medical spedig. Properly measurig, aalyzig, ad adjustig huma activity ad medical state are clearly challegig tasks. As a MEPTEC committee member, I m lookig forward to the upcomig coferece MEMS-eabled ehealth Revolutio focusig o sesors, actuators, ad architectures that eable advaced healthcare applicatios. Oe particular iterestig area is how biological sesors ad actuators may differ greatly from traditioal MEMS due to uique requiremets of these wetware devices. If your curiosity icludes how to make these devices work better tha your bathroom scale, I look forward to seeig you at the coferece! As always I ecourage your commets o my blog IRA FELDMAN (ira@feldmaegieerig.com) is the Pricipal Cosultat of Feldma Egieerig Corp. which guides high techology products ad services from cocept to commercializatio. He follows may small techologies from semicoductors to MEMS to aotechology egagig o a wide rage of projects icludig product geeratio, marketig, ad busiess developmet. Advaced Compoet Labs, Ic. Time Critical Orgaic Substrates BGA, CSP, Flip Chip, High Frequecy, High Speed, Rigid, Cavity ad Flex Packages - 20µm Lies ad Spaces - ACL is the oly North America compay focusig exclusively o the fabricatio of High Desity Itercoects. ITAR Registered Phoe: acl1@aclusa.com IC ICAssembly Assembly Advaced Packagig Packagig Advaced QFN s, QFN s, Leaded Leaded Packages, Modules, SiP s Packages 2, 2.5 & 3D Advaced Packagig Modules, SiP s Quick Turs, Developmet, Productio 2, 2.5 & 3D AdvacedNPI, Packagig Show actual size 2.25 x 4.6 ISO 13485:2003 Medical Certified ITAR Registered Quick Turs, IPC-A-610 Class 3 AssemblyDevelopmet, Class 100 Clea Room NPI, Productio ISO 13485:2003 Medical Certified ITAR Registered IPC-A-610 Class 3 Assembly Class 100 Clea Room Silico Valley s Packagig Foudry Silico Valley s Packagig Foudry SPRING 2013 MEPTEC REPORT 15 Cotact: gedwards@meptec.org 7

11 MEPTEC Web Baer Advertisig MEPTEC baer ads are a low cost way to gai exposure for your compay while stretchig your advertisig dollars. MEPTEC Baer ads start as low as $95.00 per moth for a sigle uit baer, up $ per moth for a quad baer, whe purchased o a 12 moth cotract. All baers appear i the right-had colum o every page of the MEPTEC website ad are positioed o a first-come first-served basis. Baer Ad Sizes Sigle Baer: 120 pixels (w) x 90 pixels (h) Double Baer: 120 pixels (w) x 180 pixels (h) Triple Baer: 120 pixels (w) x 270 pixels (h) Quad Baer: 120 pixels (w) x 360 pixels (h) Baer Ad Specificatios Accepted i GIF format oly, aimatio permitted. 15K maximum file size for Sigle uit baer, 30K for Double, 45K for Triple, ad 60K maximum file size for Quad baer. Please provide the URL address for the specific page that you would like to have your ad liked. Baer Prices MEPTEC Member Rate (cost per moth) No-Member Rate (cost per moth) Sigle Double Triple Quad Sigle Double Triple Quad 1 Moth $125 $250 $375 $500 $150 $300 $450 $600 3 Moths Moths Moths Cotact Gia Edwards at gedwards@meptec.org to place your order. 8

12 MEPTEC Baer Ads A limited umber of MEPTEC Mothly Update Baer Ads are ow available to MEPTEC Members oly. These baer ads cost $45.00 per moth for a sigle uit baer, or $ for 12 moths whe purchased o a 12 moth cotract. All baers appear i the left-had colum ad are positioed o a first-come first-served basis. A maximum of 10 baers will appear o each Mothly Update . Curret mothly distributio umbers approximately 4500 recipiets. Baer Ad Size 120 pixels (w) x 90 pixels (h) Baer Ad Specificatios Accepted i GIF format oly, aimatio permitted. 15K maximum file size for sigle uit baer. Please provide the URL address for the specific page that you would like to have your ad liked. Baer Prices Available to MEPTEC Members Oly Sigle Uit Baer 1 Moth $45.00 per moth 12 Moths $37.50 per moth Cotact Gia Edwards at gedwards@meptec.org to place your order. 9

13 MEDIA SPONSORS Diamod Sposor Preseted by Silver Sposor Associatio Sposor MEPTEC Evet Sposorship MEPTEC offers a variety of evet sposorship opportuities for its techical symposiums. Evet sposorship provides a valuable opportuity to promote your compay brad ad product or service message to attedees while supportig your busiess developmet ad positioig goals. Typical Sposorship Beefits iclude: Platium Sposor: $3,250-3 available per evet Compay ame & logo listed as Platium Sposor o all promotioal materials, icludig ad web promotios Full-page black & white ad i evet proceedigs 3 free admissios to symposium 1 tabletop exhibit display at evet Featured as Platium Sposor i symposium proceedigs 1 CD of symposium proceedigs Compay logo/descriptio displayed o video scree at begiig of evet Sigage recogitio at evet Exposure i semicoductor idustry trade magazies (deadlie restrictios) Discout o future MEPTEC Report 1/2 page or larger, 4-color ad Gold Sposor: $2,500 5 available per evet Compay ame & logo listed as Sposor o all promotioal materials, icludig ad web promotios Full-page black & white ad i evet proceedigs 2 free admissios to symposium 1 tabletop exhibit display at evet Featured as Gold Sposor i symposium proceedigs 1 CD of symposium proceedigs Compay logo/descriptio displayed o video scree at begiig of evet Sigage recogitio at evet Exposure i semicoductor idustry trade magazies (deadlie restrictios) Discout o future MEPTEC Report 1/2 page or larger, 4-color ad MEPTEC PRESENTS Eleveth Aual MEMS TEchology SympoSium mems-eabled ehealth Revolutio MEMS ad NEMS Based Applicatios for Emergig Healthcare Off-body, O-body, ad I-body Participatig Compaies: AliveCor, Ic. BodyMedia, Ic. BridgeWave Commuicatios Case Wester Reserve Uiversity Fairchild Semicoductor Feldma Egieerig Corp. IHS isuppli Iovative Micro Techology KWJ Egieerig, Ic. MC10 Ic. Mobisate Proteus Digital Health Ic. Terepac Corporatio Uiversity of Califoria at Berkeley Uiversity of Califoria at Irvie Uiversity of Massachusetts, Amherst Xses Techologies m A y 22, 2013 SA Jo SE, c A lif o R ia A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM Roadmaps for Multi Die Itegratio Strategies ad Drivers S A N T A C L A R A C A L I F O R N I A Silver Sposor: $1, available per evet Compay ame & logo listed as Sposor o all promotioal materials, icludig ad web promotios 1/2 page black & white ad i evet proceedigs 1 free admissio to symposium Featured as Sposor i symposium proceedigs 1 CD of symposium Proceedigs Compay logo/descriptio displayed o video scree at begiig of evet Sigage recogitio at evet Exposure i semicoductor idustry trade magazies (deadlie restrictios) Note: Sposorship pricig ad beefits may vary from evet to evet. For specific sposorship details ad more iformatio cotact Gia Edwards at gedwards@meptec.org. 10

14 MEPTEC Evet Exhibitig Opportuities MEPTEC offers table top exhibit opportuities at its techical symposiums throughout the year. A limited umber of table-top exhibit spaces are available o a first-come, first-served basis. Each draped table is 2-6 x 6-0. The cost icludes a table ad chairs, a complimetary table top sig, compay descriptio i the Symposium proceedigs, ad oe complimetary admissio to the symposium. You may use your table to display literature, parts, small pieces of equipmet, table top display sigs, etc. A table top sig will be provided, but you may also wish to display a baer or some other appropriate type of sig o the frot or top of the table. Visit the MEPTEC website for curretly scheduled evets. For more iformatio cotact Gia Edwards at gedwards@meptec.org. 11