Outline. packaging. 1. ASE Group introduc9on. 2. IoT, defini9on and perspec9ves. 3. Supply chain challenges. 4. Hardware integra9on challenges

Transcription

1 Outline 1. ASE Group introduc9on 2. IoT, defini9on and perspec9ves 3. Supply chain challenges 4. Hardware integra9on challenges 5. Low cost and small size with SiP and advanced MEMS packaging 6. Conclusion 1

2 1- ASE Group Introduc9on 2

3 ASE Group: Business Units Chairman Jason Chang Richard Chang ASE ATM USI Real Estate Tien Wu COO Tien Wu CEO 2014 revenues: $5.3B $3.5B 3

4 ASE Group Synergies ASE USI Main operations IC assembly and test (A&T) services Module/System Design and Manufacturing Services (DMS) Main technologies die attach, wire bonding, bumping, flip chip, moulding, IC test, Wafer level packaging Accuracy range 1µm 50µm 20µm-100µm Business models - Outsourced IC assembly and test services. Compartment Shielding, Conformal Shielding, Hi-Density SMT, and Embedded Technologies. - Module/System design and manufacture including Supply chain and Services. ASE is a service company USI is a service company 4

5 2- The Internet of Things : definiton and perspec9ves The next big thing in the industry? 5

6 ! The Internet of Things (IoT) is the network of physical objects or "things" embedded with electronics, sozware, sensors and connec9vity to enable it to achieve greater value and service by exchanging data with the manufacturer, operator and/or other connected devices Source: Wikipedia Courtesy of Cisco 6

7 Volume Paradigm: 10X in 10Y, accelera9ng Cell Phone (PP) 1.8B+ Units Smart Computing (PMP) 10B+ Units Internet of Things (IOT) (PMMP) 100B+ Units Exponential Connectivity & Big Data PC (PM) 350M+ Units Mainframe Millions Units Long Tail Aerospace Thousands Units 1970s 1980s 1990s 2000s 2010s We are here 2020s 7

8 IoT is a not a market, it s a tech trend Home Heating Mgt Courtesy of Beecham Research 8

9 ASE Group s IoT & MEMS/sensors vision! The IoT might well be the next big thing in the electronics industry with trillions of components per year! Each IoT module will carry at least one MEMS and/or sensor! For this to happen the following condi9ons must be fulfilled: 1. business model alignment / standardization 2. Communication protocol standardization 3.Cost/performance/size optimization of the module hardware 9

10 3- Supply Chain Challenges business model & so<ware protocol standardiza?on 10

11 Low power wireless module vendors Texas Instruments, Silicon Laboratories, Freescale, Atmel, Microchip, Renesas, GreenPeak, NXP CSR, Texas Instruments, Nordic Semiconductor, ST Microelectronics, Broadcom Nordic Semiconductor, Texas Instruments WEARABLES! Which RF comm standard will prevail for SPORTS & FITNESS IoT Applications? HOME AUTOMATION Sigma Designs SMART ENERGY DSP Group, Dialog Semiconductor, Lantiq ENERGY HARVESTING Rohm, Texas Instruments Microchip, Redpine Signals, GainSpan, Ozmo 11

12 Home Hea9ng Automa9on: Technology & Architecture (Op9on 1) 3 G 3 G 12

13 Home Hea9ng Automa9on: Technology & Architecture (Op9on 2) 3 G 13

14 Home Hea9ng Automa9on: Technology & Architecture (Op9on 3) 3 G 14

15 Home Hea9ng Automa9on: Supply Chain Challenges for services to the consumer British Gas Kelag RWE Energy Provider? Heating System Thermostat Electrician Consumer Router? Internet Service Provider?? OS Mobile Phone Telecom Service Provider 15

16 4. Hardware integra9on challenges 16

17 Manufacturing IoT modules by the billions Autonomous Cost Effective Miniature Plug & play Power management IC Connectivity IC with integrated antenna Sensor(s) Battery and energy scavenging Micro-controller ASE Group. All rights reserved. 17

18 Manufacturing IoT modules by the billions Autonomous Cost Effective Miniature Plug & play! Not a single player can do it all: partnership needed for fast and cost effec9ve plug and play design and manufacture! Mul9- partner SiP has always been an issue because of the so- called known good die liability issue, but it has the ability to make it small and cost effec9ve! Mul9ple SiPs per IoT module will be needed in the first place, for RF and for sensors 18

19 6- Low cost and small size with SiP and advanced MEMS packaging 19

20 What is an SiP Module? SiP module is a package that contains an electronic system or sub-system and is miniaturized through IC assembly technologies. Miniaturized Module Package Electronic System FuncBonality IC Assembly Technology

21 SiP Module Technologies Conformal Shielding - RF EMI Shielding Compartment Shielding - Pkg. Internal RF EMI Shielding WLP - Bare die package - SMT AoP (Antenna on Package) - Antenna IntegraBon for 2.4G/5G/60GHz IPD and Embedded SBS - Integrated Passive Devices - EDS & EPS Thermal Enhancement Irregular Cu- Pillar - Thermal DissipaBon Stacked Die / Pkg - Flip Chip & Wire Bond SMT - Passives - Connectors - Rigid or Flex ASE Confidential / Security-B 21

22 SiP value mapping Above chart from Sony Tsugio Makimoto and Infineon Grit Sommer (2005)! In many cases, systems are made of a weighted mix of SoC, SiP and SoB! SoC not enough flexible for the IoT, SoB too large and expensive in high volumes: some SiP op9miza9on is required 22

23 SiP technologies - Double Sided Module - Introduc9on Conven9onal Double Sided Module Advanced Structure Substrate SI SI Solder Ball Top/Bolom View Side View - Type I Mold Underfill (MUF) Conformal Shielding (OpBon) Substrate Substrate Mold Underfill (MUF) SI Substrate Interposer Side View SI Undefill SI Side View - Type II SI Solder Ball Advantage : Larger design space and no underfill required to fix substrate interposer (SI) Design Flexibility: FC, WB/Stacking on Bo_om Side AddiBonal package level shielding implement flexibility, eg. conformal shielding. 23

24 SiP Technologies - Antenna on Package (AoP) - Provide 40 meter communica9on range for wearable applica9on Stamped Antenna Stamped Antenna Antenna Feed In Point 6.5 mm BLE Chip 6.5 mm Component and Metal Stamped Antenna Pick & Place Over Mold or Exposed Mold 24

25 SiP Technologies - ASE EMI Shielding Conformal Shielding Dual Band WiFi/BT Module Compartment Shielding LGA- type WWAN Module Laser Trench Type Metal Frame Type Conformal Metal Coating Compartment Molding Substrate Side View Metal Coating Molding Compound SUS Cu Metal Trench SUS 25

26 SiP Technologies - What s SESUB? SESUB = Semiconductor Embedded in SUBstrate SESUB Cross Section SESUB can be treated like typical PCB, SMT devices can mount on it. 300um Embedded IC Embedded IC! SESUB is TDK s the state of the art substrate solu9on for SiP! IC wafer is grinded to 50um and embedding in resin substrate and it enables total substrate thickness to be 300um! SESUB is already proven technology by many customers and IC vendors 26

27 SiP Technologies - SESUB Key Features 27

28 28

29 A wide technology diversity is needed for the packaging of MEMS & sensors Current package pla2orms at ASE sensor die LF or LGA Cavity molded package LF Pre- mold LF + individual Lid MEMS ASIC Cavity ceramic LGA Op9cal LGA/QFN ASIC ASIC LF Pre- mold DFN/QFN + Plas9c Lid ASIC LGA + Metal lid CoW Cap MEMS ASIC Overmolded package (QFN, LGA, BGA, ) ASIC LGA + Plas9c Lid sensor die WLCSP sensor die 3D WLP 29

30 The sensors packaging paradox: specific requirements by applica<on Contradiction: you want to sense the environment but not all the environment. The package is a protection from the environment! Examples You want to sense temperature and humidity, but you don t want corrosion! Iner9al (mo9on) sensors: need to sense real 9me accelera9on and shocks; we want to maximize coupling with substrate Pressure sensors: pressure is very sensi9ve. Mechanical stress from the substrate (by warping) or external shocks pollute the measurement. We want to minimize coupling to the substrate The package is a functional filter: it selects what should be let in from what is kept outside 30

31 ASE MEMS & Sensor produc9on status Package plamorms Total (estimated): 1.59Bunits Total (projection): 2.15Bunits 2014 MEMS & Sensor ASE production is based on best available data 2015 MEMS & Sensor production is based on available forecasts and some assumptions Large technology portfolio with flexible process options is key to serve MEMS & Sensor market towards technology diversification 31

32 ASE MEMS & Sensor produc9on status By applica?ons There is strong push for Optical and fenvironmental sensors (pressure and gas sensors entering the consumer market) in 2015 From the forecasts we can confirm the trend in diversification of MEMS & Sensors applications 32

33 WLP- TSV for MEMS & Sensors Miniaturiza9on & Performance! Enable MEMS to become WLP X O! Perfect match to: Faced- up sensing, Faced- down rou9ng Sensor Sensor! Shorter route, Less L & R Environment Sensor ALS/ Image Sensor WB TSV ASIC 33

34 Footprint benefit by applica9on 70% LGA WLP! Footprint benefit of WLP is greater for replacement of Cavity LGA devices. 29% 20% 25%! Benefit is respec9vely less significant w.r.t. mold LGA Mold LGA Open Cavity LGA 34

35 Lower profile benefit by applica9on LGA WLP! WLP is a good solu9on to reach <0.6mm Pkg height, especially for single die devices. Mold LGA Open Cavity LGA 35

36 Q ASE WLP- TSV MEMS & Sensors status 36

37 Example of a Smart Sensor System (SiP with sensors)! Applica9on: Smart handheld (light, proximity, gesture), body mo9on and physiological sign sensing Smart Integration Size: PCB: 27x20mm Sensor: 15x10mm - G- LED(525nm), R- LED(660nm), IR- LED(940nm) - PD - MEMS/Pressure sensor - Analog AFE(22bits) Compartment by ID housing! Benefit realized: 80% size reduc9on and improved op9cal signal quality by using new package playorms (embedded, LCP lid, OLGA) SpO2: Oxygen Satura9on, Blood Oxygen Size: < 8x8x1.2mm Beler Signal Quality & Minimize Engineering Tuning Effort Technologies Leveraged: A. Stack Die & WB B. HDSMT C. Embedded SBS D. Molding w/ LCP 37

38 Conclusion 38

39 Conclusion SmartWatch Card Reader Headset Fitness! The main hurdle to the IoT ubiquitous propaga9on is the standardiza9on of business models in the food chain to the end user, including connec9vity and sozware MEMS! Hardware electronics also commands some level of standardiza9on. To produce sensor modules by the billions will require partnerships for plug & play modulariza9on, as well as low- cost and miniature integra9on thanks to op9mized technology playorms! ASE group offers cost effec9ve miniaturiza9on for high volume manufacturing based on our extended SiP and MEMS packaging technology poryolio, as well as flexible business models to enable SiP across mul9- partners Biometric Connectivity 39

40 Thank You 40