STMicroelectronics Standard Technology offers at CMP in 2017 Deep Sub-Micron, SOI and SiGe Processes

SEMICONDUCTOR TECHNOLOGY -CMOS-

SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails. Currently,

SEMICONDUCTOR TECHNOLOGY -CMOS-

SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada 2011/12/19 1 What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails.

Enabling Analog Integration. Paul Kempf

TM Enabling Analog Integration Paul Kempf Overview The New Analog Analog in New Markets Opportunity in Integrated Analog/RF Outsourcing Trends in Analog Enabling Functional Integration Technology Requirements

RFSOI and FDSOI enabling smarter and IoT applications. Kirk Ouellette Digital Products Group STMicroelectronics

RFSOI and FDSOI enabling smarter and IoT applications Kirk Ouellette Digital Products Group STMicroelectronics ST in the IoT already Today 2 Kirk Ouellette More then Moore Workshop - Shanghai - March 17,

High-Performance Technologies for an Analog-Centric World

High-Performance Technologies for an Analog-Centric World Oct 13, 2011 Lou N. Hutter, SVP GM, Analog Foundry Business Unit Dongbu HiTek Agenda Analog in Our World Today Diverse Technology Needs of the

Digital Integrated Circuits EECS 312

14 12 10 8 6 Fujitsu VP2000 IBM 3090S Pulsar 4 IBM 3090 IBM RY6 CDC Cyber 205 IBM 4381 IBM RY4 2 IBM 3081 Apache Fujitsu M380 IBM 370 Merced IBM 360 IBM 3033 Vacuum Pentium II(DSIP) 0 1950 1960 1970 1980

Digital Integrated Circuits EECS 312. Review. Remember the ENIAC? IC ENIAC. Trend for one company. First microprocessor

14 12 10 8 6 IBM ES9000 Bipolar Fujitsu VP2000 IBM 3090S Pulsar 4 IBM 3090 IBM RY6 CDC Cyber 205 IBM 4381 IBM RY4 2 IBM 3081 Apache Fujitsu M380 IBM 370 Merced IBM 360 IBM 3033 Vacuum Pentium II(DSIP)

EL302 DIGITAL INTEGRATED CIRCUITS LAB #3 CMOS EDGE TRIGGERED D FLIP-FLOP. Due İLKER KALYONCU, 10043

EL302 DIGITAL INTEGRATED CIRCUITS LAB #3 CMOS EDGE TRIGGERED D FLIP-FLOP Due 16.05. İLKER KALYONCU, 10043 1. INTRODUCTION: In this project we are going to design a CMOS positive edge triggered master-slave

STMicroelectronics L6262S BCD-MOS IC Structural Analysis

April 2, 2004 STMicroelectronics L6262S BCD-MOS IC Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,

24. Scaling, Economics, SOI Technology

24. Scaling, Economics, SOI Technology Jacob Abraham Department of Electrical and Computer Engineering The University of Texas at Austin VLSI Design Fall 2017 December 4, 2017 ECE Department, University

PICOSECOND TIMING USING FAST ANALOG SAMPLING

PICOSECOND TIMING USING FAST ANALOG SAMPLING H. Frisch, J-F Genat, F. Tang, EFI Chicago, Tuesday 6 th Nov 2007 INTRODUCTION In the context of picosecond timing, analog detector pulse sampling in the 10

IC Mask Design. Christopher Saint Judy Saint

IC Mask Design Essential Layout Techniques Christopher Saint Judy Saint McGraw-Hill New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto

Analog, Mixed-Signal, and Radio-Frequency (RF) Electronic Design Laboratory. Electrical and Computer Engineering Department UNC Charlotte

Analog, Mixed-Signal, and Radio-Frequency (RF) Electronic Design Laboratory Electrical and Computer Engineering Department UNC Charlotte Teaching and Research Faculty (Please see faculty web pages for

Integrated Circuit Design ELCT 701 (Winter 2017) Lecture 1: Introduction

1 Integrated Circuit Design ELCT 701 (Winter 2017) Lecture 1: Introduction Assistant Professor Office: C3.315 E-mail: eman.azab@guc.edu.eg 2 Course Overview Lecturer Teaching Assistant Course Team E-mail:

Sharif University of Technology. SoC: Introduction

SoC Design Lecture 1: Introduction Shaahin Hessabi Department of Computer Engineering System-on-Chip System: a set of related parts that act as a whole to achieve a given goal. A system is a set of interacting

Semiconductors Displays Semiconductor Manufacturing and Inspection Equipment Scientific Instruments

Semiconductors Displays Semiconductor Manufacturing and Inspection Equipment Scientific Instruments Electronics 110-nm CMOS ASIC HDL4P Series with High-speed I/O Interfaces Hitachi has released the high-performance

High Performance Microprocessor Design and Automation: Overview, Challenges and Opportunities IBM Corporation

High Performance Microprocessor Design and Automation: Overview, Challenges and Opportunities Introduction About Myself What to expect out of this lecture Understand the current trend in the IC Design

[2 credit course- 3 hours per week]

Syllabus of Applied Electronics for F Y B Sc Semester- 1 (With effect from June 2012) PAPER I: Components and Devices [2 credit course- 3 hours per week] Unit- I : CIRCUIT THEORY [10 Hrs] Introduction;

Design Of Analog Cmos Integrated Circuits Razavi Solutions

Design Of Analog Cmos Integrated Circuits Razavi Solutions DESIGN OF ANALOG CMOS INTEGRATED CIRCUITS RAZAVI SOLUTIONS PDF - Are you looking for design of analog cmos integrated circuits razavi solutions

EECS150 - Digital Design Lecture 2 - CMOS

EECS150 - Digital Design Lecture 2 - CMOS January 23, 2003 John Wawrzynek Spring 2003 EECS150 - Lec02-CMOS Page 1 Outline Overview of Physical Implementations CMOS devices Announcements/Break CMOS transistor

Report on 4-bit Counter design Report- 1, 2. Report on D- Flipflop. Course project for ECE533

Report on 4-bit Counter design Report- 1, 2. Report on D- Flipflop Course project for ECE533 I. Objective: REPORT-I The objective of this project is to design a 4-bit counter and implement it into a chip

A FOUR GAIN READOUT INTEGRATED CIRCUIT : FRIC 96_1

A FOUR GAIN READOUT INTEGRATED CIRCUIT : FRIC 96_1 J. M. Bussat 1, G. Bohner 1, O. Rossetto 2, D. Dzahini 2, J. Lecoq 1, J. Pouxe 2, J. Colas 1, (1) L. A. P. P. Annecy-le-vieux, France (2) I. S. N. Grenoble,

Leakage Current Reduction in Sequential Circuits by Modifying the Scan Chains

eakage Current Reduction in Sequential s by Modifying the Scan Chains Afshin Abdollahi University of Southern California (3) 592-3886 afshin@usc.edu Farzan Fallah Fujitsu aboratories of America (48) 53-4544

CCD Element Linear Image Sensor CCD Element Line Scan Image Sensor

1024-Element Linear Image Sensor CCD 134 1024-Element Line Scan Image Sensor FEATURES 1024 x 1 photosite array 13µm x 13µm photosites on 13µm pitch Anti-blooming and integration control Enhanced spectral

MPW Service Center for ICs, Photonics & MEMS Prototyping & Low Volume Production

Circuits Multi-Projets From Layout to chips 2016 Annual Report Courtesy G2Elab MPW Service Center for ICs, Photonics & MEMS Prototyping & Low Volume Production http://cmp.imag.fr 46, Avenue Félix Viallet

Analog High Voltage ASIC Design Techniques

ASIC Technology Symposium 2009 Analog High Voltage ASIC Design Techniques Otto Manck January 20th 2009 Israel Air Force Center, 15 Jabotinski St. Hertzelia Topics Introduction Laws and rules of microelectronics

Lecture 1: Intro to CMOS Circuits

Introduction to CMOS VLSI esign Lecture : Intro to CMOS Circuits avid Harris Steven Levitan Fall 28 Harvey Mudd College Spring 24 Outline A Brief History CMOS Gate esign Pass Transistors CMOS Latches &

2. Depletion MOSFET (DE-MOSFET).

The is an abbreviation of Metal Oxide Semiconductor Field Effect Transistor. In, the gate is insulated from the channel by using SiO 2 layer. The input impedance of is high, because the gate current is

Lecture 1: Circuits & Layout

Lecture 1: Circuits & Layout Outline A Brief History CMOS Gate esign Pass Transistors CMOS Latches & Flip-Flops Standard Cell Layouts Stick iagrams 2 A Brief History 1958: First integrated circuit Flip-flop

ELEC 4609 IC DESIGN TERM PROJECT: DYNAMIC PRSG v1.2

ELEC 4609 IC DESIGN TERM PROJECT: DYNAMIC PRSG v1.2 The goal of this project is to design a chip that could control a bicycle taillight to produce an apparently random flash sequence. The chip should operate

Applied Materials. 200mm Tools & Process Capabilities For Next Generation MEMS. Dr Michel (Mike) Rosa

Applied Materials 200mm Tools & Process Capabilities For Next Generation MEMS Dr Michel (Mike) Rosa 200mm MEMS Global Product / Marketing Manager, Components and Systems Group (CSG), Applied Global Services

Semiconductor Devices. Microwave Application Products. Microwave Tubes and Radar Components

Microwave Application Products Microwave Tubes and Radar Components Our semiconductor products are mostly analog semiconductors classified broadly into three groups: Bipolar ICs, MOS ICs, and Microwave

VLSI Design Digital Systems and VLSI

VLSI Design Digital Systems and VLSI Somayyeh Koohi Department of Computer Engineering Adapted with modifications from lecture notes prepared by author 1 Overview Why VLSI? IC Manufacturing CMOS Technology

Adding Analog and Mixed Signal Concerns to a Digital VLSI Course

Session Number 1532 Adding Analog and Mixed Signal Concerns to a Digital VLSI Course John A. Nestor and David A. Rich Department of Electrical and Computer Engineering Lafayette College Abstract This paper

International Research Journal of Engineering and Technology (IRJET) e-issn: Volume: 03 Issue: 07 July p-issn:

IC Layout Design of Decoder Using Electrical VLSI System Design 1.UPENDRA CHARY CHOKKELLA Assistant Professor Electronics & Communication Department, Guru Nanak Institute Of Technology-Ibrahimpatnam (TS)-India

nmos transistor Basics of VLSI Design and Test Solution: CMOS pmos transistor CMOS Inverter First-Order DC Analysis CMOS Inverter: Transient Response

nmos transistor asics of VLSI Design and Test If the gate is high, the switch is on If the gate is low, the switch is off Mohammad Tehranipoor Drain ECE495/695: Introduction to Hardware Security & Trust

EE262: Integrated Analog Circuit Design

EE262: Integrated Analog Circuit Design Instructor: Dr. James Morizio Home phone: 919-596-8069, Cell Phone 919-225-0615 email: jmorizio@ee.duke.edu Office hours: Thursdays 5:30-6:30pm Grader: Himanshu

PHYSICAL DESIGN ESSENTIALS An ASIC Design Implementation Perspective

PHYSICAL DESIGN ESSENTIALS An ASIC Design Implementation Perspective PHYSICAL DESIGN ESSENTIALS An ASIC Design Implementation Perspective Khosrow Golshan Conexant Systems, Inc. 1 3 Khosrow Golshan Conexant

Boolean, 1s and 0s stuff: synthesis, verification, representation This is what happens in the front end of the ASIC design process

(Lec 11) From Logic To Layout What you know... Boolean, 1s and 0s stuff: synthesis, verification, representation This is what happens in the front end of the ASIC design process High-level design description

1967 FIRST PRODUCTION MOS CHIPS 1969 LSI ( TRANSISTORS) PMOS, NMOS, CMOS 1969 E-BEAM PRODUCTION, DIGITAL WATCHES, CALCULATORS 1970 CCD

HISTORY OF VLSI 1948 TRANSISTOR INVENTED (SHOCKLEY AT&T) GERMANIUM-GOLD CONTACT 1954 SILICON TRANSISTOR (TEAL TI) HIGHT TEMP. 1956 TRANSISTOR COMPUTER (CRAY) 1958 FIRST MONOLITHIC CIRCUIT (IC) BJTs (KIRBY

Innovative Fast Timing Design

Innovative Fast Timing Design Solution through Simultaneous Processing of Logic Synthesis and Placement A new design methodology is now available that offers the advantages of enhanced logical design efficiency

Overview of All Pixel Circuits for Active Matrix Organic Light Emitting Diode (AMOLED)

Chapter 2 Overview of All Pixel Circuits for Active Matrix Organic Light Emitting Diode (AMOLED) ---------------------------------------------------------------------------------------------------------------

FDTD_SPICE Analysis of EMI and SSO of LSI ICs Using a Full Chip Macro Model

FDTD_SPICE Analysis of EMI and SSO of LSI ICs Using a Full Chip Macro Model Norio Matsui Applied Simulation Technology 2025 Gateway Place #318 San Jose, CA USA 95110 matsui@apsimtech.com Neven Orhanovic

AMI C5N Process Design Rules

AMI C5N Process Design Rules Version 1.1 UCSN-0400-ZBT-05 September 2000 Z. Tao and M. Keramat Analog & Mixed-Signal Laboratory Department of Electrical & Systems Engineering UNIVERSITY OF CONNECTICUT

IC TECHNOLOGY Lecture 2.

IC TECHNOLOGY Lecture 2. IC Integrated Circuit Technology Integrated Circuit: An integrated circuit (IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor

Low Power High Speed Voltage Level Shifter for Sub- Threshold Operations

International Journal of Innovative Research in Electronics and Communications (IJIREC) Volume 1, Issue 5, August 2014, PP 34-41 ISSN 2349-4042 (Print) & ISSN 2349-4050 (Online) www.arcjournals.org Low

Power Distribution and Clock Design

Lecture 3 Power Distribution and Clock Design R. Saleh Dept. of ECE University of British Columbia res@ece.ubc.ca 1 Overview of Lecture Power distribution in the past was a fairly simple task Goal of power

EVALUATION KIT AVAILABLE 12.5Gbps Settable Receive Equalizer +2.5V +3.3V V CC1 V CC. 30in OF FR-4 STRIPLINE OR MICROSTRIP TRANSMISSION LINE SDI+ SDI-

19-2713; Rev 1; 11/03 EVALUATION KIT AVAILABLE 12.5Gbps Settable Receive Equalizer General Description The driver with integrated analog equalizer compensates up to 20dB of loss at 5GHz. It is designed

Modifying the Scan Chains in Sequential Circuit to Reduce Leakage Current

IOSR Journal of VLSI and Signal Processing (IOSR-JVSP) Volume 3, Issue 1 (Sep. Oct. 2013), PP 01-09 e-issn: 2319 4200, p-issn No. : 2319 4197 Modifying the Scan Chains in Sequential Circuit to Reduce Leakage

An Introduction to VLSI (Very Large Scale Integrated) Circuit Design

An Introduction to VLSI (Very Large Scale Integrated) Circuit Design Presented at EE1001 Oct. 16th, 2018 By Hua Tang The first electronic computer (1946) 2 First Transistor (Bipolar) First transistor Bell

IC Layout Design of Decoders Using DSCH and Microwind Shaik Fazia Kausar MTech, Dr.K.V.Subba Reddy Institute of Technology.

IC Layout Design of Decoders Using DSCH and Microwind Shaik Fazia Kausar MTech, Dr.K.V.Subba Reddy Institute of Technology. T.Vijay Kumar, M.Tech Associate Professor, Dr.K.V.Subba Reddy Institute of Technology.

Designing VeSFET-based ICs with CMOS-oriented EDA Infrastructure

Designing VeSFET-based ICs with CMOS-oriented ED Infrastructure Xiang Qiu, Malgorzata Marek-Sadowska University of California, Santa arbara Wojciech Maly Carnegie Mellon University Outline Introduction

Power Device Analysis in Design Flow for Smart Power Technologies

Power Device Analysis in Design Flow for Smart Power Technologies A.Bogani, P.Cacciagrano, G.Ferre`, L.Paciaroni, M.Verga ST Microelectronics, via Tolomeo 1 Cornaredo 20010, Milano, Italy M.Ershov,Y.Feinberg

Timing EECS141 EE141. EE141-Fall 2011 Digital Integrated Circuits. Pipelining. Administrative Stuff. Last Lecture. Latch-Based Clocking.

EE141-Fall 2011 Digital Integrated Circuits Lecture 2 Clock, I/O Timing 1 4 Administrative Stuff Pipelining Project Phase 4 due on Monday, Nov. 21, 10am Homework 9 Due Thursday, December 1 Visit to Intel

Design of Low Power D-Flip Flop Using True Single Phase Clock (TSPC)

Design of Low Power D-Flip Flop Using True Single Phase Clock (TSPC) Swetha Kanchimani M.Tech (VLSI Design), Mrs.Syamala Kanchimani Associate Professor, Miss.Godugu Uma Madhuri Assistant Professor, ABSTRACT:

DIGITAL TECHNICS. Dr. Bálint Pődör. Óbuda University, Microelectronics and Technology Institute

DIGITL TECHNICS Dr. álint Pődör Óbuda University, Microelectronics and Technology Institute 10. LECTURE (LOGIC CIRCUITS, PRT 2): MOS DIGITL CIRCUITS II 2016/2017 10. LECTURE: MOS DIGITL CIRCUITS II 1.

System IC Design: Timing Issues and DFT. Hung-Chih Chiang

System IC esign: Timing Issues and FT Hung-Chih Chiang Outline SoC Timing Issues Timing terminologies Synchronous vs. asynchronous design Interfaces and timing closure Clocking issues Reset esign for Testability

CS/EE 6710 Digital VLSI Design CAD Assignment #3 Due Thursday September 21 st, 5:00pm

CS/EE 6710 Digital VLSI Design CAD Assignment #3 Due Thursday September 21 st, 5:00pm Overview: In this assignment you will design a register cell. This cell should be a single-bit edge-triggered D-type

MAHARASHTRA STATE BOARD OF TECHNICAL EDUCATION (Autonomous)

Subject Code: 17320 Model Answer Page 1 of 32 Important Instructions to examiners: 1) The answers should be examined by key words and not as word-to-word as given in the Model answer scheme. 2) The model

Chapter 3 Evaluated Results of Conventional Pixel Circuit, Other Compensation Circuits and Proposed Pixel Circuits for Active Matrix Organic Light Emitting Diodes (AMOLEDs) -------------------------------------------------------------------------------------------------------

Future of Analog Design and Upcoming Challenges in Nanometer CMOS

Future of Analog Design and Upcoming Challenges in Nanometer CMOS Greg Taylor VLSI Design 2010 Outline Introduction Logic processing trends Analog design trends Analog design challenge Approaches Conclusion

The ATLAS Pixel Chip FEI in 0.25µm Technology

The ATLAS Pixel Chip FEI in 0.25µm Technology Peter Fischer, Universität Bonn (for Ivan Peric) for the ATLAS pixel collaboration The ATLAS Pixel Chip FEI Short Introduction to ATLAS Pixel mechanics, modules

CCD 143A 2048-Element High Speed Linear Image Sensor

A CCD 143A 2048-Element High Speed Linear Image Sensor FEATURES 2048 x 1 photosite array 13µm x 13µm photosites on 13µm pitch High speed = up to 20MHz data rates Enhanced spectral response Low dark signal

Challenges in the design of a RGB LED display for indoor applications

Synthetic Metals 122 (2001) 215±219 Challenges in the design of a RGB LED display for indoor applications Francis Nguyen * Osram Opto Semiconductors, In neon Technologies Corporation, 19000, Homestead

Introduction to CMOS VLSI Design (E158) Lecture 11: Decoders and Delay Estimation

Harris Introduction to CMOS VLSI Design (E158) Lecture 11: Decoders and Delay Estimation David Harris Harvey Mudd College David_Harris@hmc.edu Based on EE271 developed by Mark Horowitz, Stanford University

EECS150 - Digital Design Lecture 17 - Circuit Timing. Performance, Cost, Power

EECS150 - Digital Design Lecture 17 - Circuit Timing March 10, 2011 John Wawrzynek Spring 2011 EECS150 - Lec16-timing Page 1 Performance, Cost, Power How do we measure performance? operations/sec? cycles/sec?

FinFETs & SRAM Design

FinFETs & SRAM Design Raymond Leung VP Engineering, Embedded Memories April 19, 2013 Synopsys 2013 1 Agenda FinFET the Device SRAM Design with FinFETs Reliability in FinFETs Summary Synopsys 2013 2 How

A Design for Improved Very Low Power Static Flip Flop Using Two Inverters and Five NORs

A Design for Improved Very Low Power Static Flip Flop Using Two Inverters and Five NORs Jogi Prakash 1, G. Someswara Rao 2, Ganesan P 3, G. Ravi Kishore 4, Sandeep Chilumula 5 1 M Tech Student, 2, 4, 5

3D-CHIP TECHNOLOGY AND APPLICATIONS OF MINIATURIZATION

3D-CHIP TECHNOLOGY AND APPLICATIONS OF MINIATURIZATION 23.08.2018 I DAVID ARUTINOV CONTENT INTRODUCTION TRENDS AND ISSUES OF MODERN IC s 3D INTEGRATION TECHNOLOGY CURRENT STATE OF 3D INTEGRATION SUMMARY

LFSR Counter Implementation in CMOS VLSI

LFSR Counter Implementation in CMOS VLSI Doshi N. A., Dhobale S. B., and Kakade S. R. Abstract As chip manufacturing technology is suddenly on the threshold of major evaluation, which shrinks chip in size

TKK S ASIC-PIIRIEN SUUNNITTELU

Design TKK S-88.134 ASIC-PIIRIEN SUUNNITTELU Design Flow 3.2.2005 RTL Design 10.2.2005 Implementation 7.4.2005 Contents 1. Terminology 2. RTL to Parts flow 3. Logic synthesis 4. Static Timing Analysis

Why Use the Cypress PSoC?

C H A P T E R1 Why Use the Cypress PSoC? Electronics have dramatically altered the world as we know it. One has simply to compare the conveniences and capabilities of today s world with those of the late

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr January 2012 Written by: Maher SAHMIMI DISCLAIMER :

Multifunction Digital Timer

Multifunction Digital Timer 72 x72 mm Timer with Easy-to-use Functions Nine output modes accommodate a wide variety of applications. All parameters set by scroll-through menus accessed from the front panel.

RX40_V1_0 Measurement Report F.Faccio

RX40_V1_0 Measurement Report F.Faccio This document follows the previous report An 80Mbit/s Optical Receiver for the CMS digital optical link, dating back to January 2000 and concerning the first prototype

Imperial College OF SCIENCE, TECHNOLOGY AND MEDICINE University of London. Digital IC Design Course

Scalable CMOS Layout Design Rules Scalable CMOS Layout Design Rules Imperial College OF SCIENCE, TECHNOLOGY AND MEDICINE University of London Department of Electrical & Electronic Engineering Digital IC

CHAPTER 9. Actives Devices: Diodes, Transistors,Tubes

CHAPTER 9 Actives Devices: Diodes, Transistors,Tubes 1 The electrodes of a semiconductor diode are known as anode and cathode. In a semiconductor diode, electrons flow from cathode to anode. In order for

Digital Integrated Circuits EECS 312

14 12 10 8 6 Fujitsu VP2000 IBM 3090S Pulsar 4 IBM 3090 IBM RY6 CDC Cyber 205 IBM 4381 IBM RY4 2 IBM 3081 Apache Fujitsu M380 IBM 370 Merced IBM 360 IBM 3033 Vacuum Pentium II(DSIP) 0 1950 1960 1970 1980

Chapter 7 Memory and Programmable Logic

EEA091 - Digital Logic 數位邏輯 Chapter 7 Memory and Programmable Logic 吳俊興國立高雄大學資訊工程學系 2006 Chapter 7 Memory and Programmable Logic 7-1 Introduction 7-2 Random-Access Memory 7-3 Memory Decoding 7-4 Error

Slide Set 14. Design for Testability

Slide Set 14 Design for Testability Steve Wilton Dept. of ECE University of British Columbia stevew@ece.ubc.ca Slide Set 14, Page 1 Overview Wolf 4.8, 5.6, 5.7, 8.7 Up to this point in the class, we have

MOSIS Scalable CMOS (SCMOS) Design Rules. (Revision 7.2) The MOSIS Service USC/ISI Admiralty Way. Marina del Rey, CA

MOSIS Scalable CMOS (SCMOS) Design Rules (Revision 7.2) The MOSIS Service USC/ISI 4676 Admiralty Way Marina del Rey, CA 90292-6695 1 Introduction 1.1 SCMOS Design Rules This document defines the official

CSE140L: Components and Design Techniques for Digital Systems Lab. FSMs. Tajana Simunic Rosing. Source: Vahid, Katz

CSE140L: Components and Design Techniques for Digital Systems Lab FSMs Tajana Simunic Rosing Source: Vahid, Katz 1 Flip-flops Hardware Description Languages and Sequential Logic representation of clocks

ROM MEMORY AND DECODERS

ROM MEMORY AND DECODERS INEL427 - Spring 22 RANDOM ACCESS MEMORY Random Access Memory (RAM) read and write memory volatile Static RAM (SRAM) store information as long as power is applied will not lose

CMOS DESIGN OF FLIP-FLOP ON 120nm

CMOS DESIGN OF FLIP-FLOP ON 120nm *Neelam Kumar, **Anjali Sharma *4 th Year Student, Department of EEE, AP Goyal Shimla University Shimla, India. neelamkumar991@gmail.com ** Assistant Professor, Department

DEPFET Active Pixel Sensors for the ILC

DEPFET Active Pixel Sensors for the ILC Laci Andricek for the DEPFET Collaboration (www.depfet.org) The DEPFET ILC VTX Project steering chips Switcher thinning technology Simulation sensor development

UNIT III COMBINATIONAL AND SEQUENTIAL CIRCUIT DESIGN

UNIT III COMBINATIONAL AND SEQUENTIAL CIRCUIT DESIGN Part A (2 Marks) 1. What is a BiCMOS? BiCMOS is a type of integrated circuit that uses both bipolar and CMOS technologies. 2. What are the problems

Features. = +25 C, Vs = 5V, Vpd = 5V

v1.117 HMC326MS8G / 326MS8GE AMPLIFIER, 3. - 4. GHz Typical Applications The HMC326MS8G / HMC326MS8GE is ideal for: Microwave Radios Broadband Radio Systems Wireless Local Loop Driver Amplifier Functional

The Impact of Device-Width Quantization on Digital Circuit Design Using FinFET Structures

EE 241 SPRING 2004 1 The Impact of Device-Width Quantization on Digital Circuit Design Using FinFET Structures Farhana Sheikh, Vidya Varadarajan {farhana, vidya}@eecs.berkeley.edu Abstract FinFET structures

Using on-chip Test Pattern Compression for Full Scan SoC Designs

Using on-chip Test Pattern Compression for Full Scan SoC Designs Helmut Lang Senior Staff Engineer Jens Pfeiffer CAD Engineer Jeff Maguire Principal Staff Engineer Motorola SPS, System-on-a-Chip Design

Digital Integrated Circuits A Design Perspective Solution

We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with digital integrated circuits

I-fuse TM : Best OTP for FD-SOI and Sub-14nm

I-fuse TM : Best OTP for FD-SOI and Sub-14nm Shine Chung, Chairman May, 2017 Attopsemi Technology 1A2-A1 No. 1 Li-Hsin 1st Rd, Hsinchu, Taiwan 300-76 (886) 3-666-3150x211, (886) 920-566-218 1 1 About Attopsemi

Flip-Flops A) Synchronization: Clocks and Latches B) Two Stage Latch C) Memory Requires Feedback D) Simple Flip-Flop Gate

Lecture 19: November 5, 2001 Midterm in Class Wed. Nov 7 th Covers Material 6 th -10 th week including W#10 Closed Book, Closed Notes, Bring Calculator, Paper Provided Last Name A-K 2040 Valley LSB; Last

PHASE-LOCKED loops (PLLs) are widely used in many

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: EXPRESS BRIEFS, VOL. 52, NO. 5, MAY 2005 233 A Portable Digitally Controlled Oscillator Using Novel Varactors Pao-Lung Chen, Ching-Che Chung, and Chen-Yi Lee

UNIT V 8051 Microcontroller based Systems Design

UNIT V 8051 Microcontroller based Systems Design INTERFACING TO ALPHANUMERIC DISPLAYS Many microprocessor-controlled instruments and machines need to display letters of the alphabet and numbers. Light

Transforming Electronic Interconnect Breaking through historical boundaries Tim Olson Founder & CTO

Transforming Electronic Interconnect Breaking through historical boundaries Tim Olson Founder & CTO Remember when? There were three distinct industries Wafer Foundries SATS EMS Semiconductor Devices Nanometers

Low Power VLSI Circuits and Systems Prof. Ajit Pal Department of Computer Science and Engineering Indian Institute of Technology, Kharagpur

Low Power VLSI Circuits and Systems Prof. Ajit Pal Department of Computer Science and Engineering Indian Institute of Technology, Kharagpur Lecture No. # 29 Minimizing Switched Capacitance-III. (Refer

VLSI Chip Design Project TSEK06

VLSI Chip Design Project TSEK06 Project Description and Requirement Specification Version 1.1 Project: High Speed Serial Link Transceiver Project number: 4 Project Group: Name Project members Telephone

Digital Circuits. Innovation Fellows Program

Innovation Fellows Program Digital Circuits, http://saliterman.umn.edu/ Department of Biomedical Engineering, University of Minnesota Topics Digital Electronics TTL and CMOS Logic National Instrument s

Product Specification PE4151

PE UltraCMOS Low Frequency Passive Mixer with Integrated LO Amplifier Product Description The PE is an ultra-high linearity Quad MOSFET mixer with an integrated LO amplifier. The LO amplifier allows for

DIFFERENTIAL CONDITIONAL CAPTURING FLIP-FLOP TECHNIQUE USED FOR LOW POWER CONSUMPTION IN CLOCKING SCHEME

DIFFERENTIAL CONDITIONAL CAPTURING FLIP-FLOP TECHNIQUE USED FOR LOW POWER CONSUMPTION IN CLOCKING SCHEME Mr.N.Vetriselvan, Assistant Professor, Dhirajlal Gandhi College of Technology Mr.P.N.Palanisamy,